Industries

BERGQUIST GAP FILLER TGF 4000

  • Item Name: BERGQUIST GAP FILLER TGF 4000
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Gap Filler
  • Technologies: Silicone-based, thermally conductive, liquid gap filler
  • Applications: Automotive electronics, computers, heat sink interface, telecommunications
  • Color: Blue (cured), Part A (Blue), Part B (White)
  • Cure Type: Room temperature cure or heat cure
  • Package Size: Contact Avantek for details.
  • Shelf Life: 5 months

1. Product Overview

BERGQUIST GAP FILLER TGF 4000 is a high thermal conductivity (4.0 W/m-K), two-part, liquid gap filler designed for thermal management applications. It cures at room temperature or with heat acceleration and maintains excellent mechanical and chemical stability over a wide temperature range (-60°C to 200°C). This silicone-based material is soft, ultra-conforming, and ideal for applications where a strong structural bond is not required but effective heat dissipation is essential.


2. Applications

  • Automotive electronics (HEV, NEV, batteries)
  • Computers and peripherals
  • Telecommunications
  • Thermal interface between heat-generating semiconductors and heat sinks

3. Typical Properties

Uncured Material Properties

Property Value Test Method
Viscosity (1,500/sec), Part A & B 50,000 mPa·s (cP) ASTM D5099
Density 3.1 g/cc ASTM D792
Working Time @ 25°C 240 minutes
Shelf Life @ 25°C 150 days

Cure Schedule

Cure Condition Time
25°C 24 hours
100°C 30 minutes

Cured Material Properties

Property Value Test Method
Hardness (Shore 00) 75 ASTM D2240
Heat Capacity 0.8 J/g-K ASTM E1269
Flammability UL 94 V-0

Electrical Properties

Property Value Test Method
Dielectric Strength 450 V/mil ASTM D149
Dielectric Constant @ 1,000 Hz 7.9 ASTM D150
Volume Resistivity 1×10¹⁰ ohm-meter ASTM D257

Thermal Properties

Property Value Test Method
Thermal Conductivity 4.0 W/m-K ASTM D5470

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