Industries

BERGQUIST GAP PAD TGP 1500

  • Item Name: BERGQUIST GAP PAD TGP 1500
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Gap Filler
  • Technologies: Silicone-based, thermally conductive, electrically insulating
  • Applications: Used for thermal management in telecommunications, computers, power conversion, memory modules, and heat spreaders
  • Color: Black
  • Cure Type: Not applicable (pre-cured gap pad)
  • Package Size: Contact Avantek for details
  • Shelf Life: 6 months

1. Product Overview

BERGQUIST GAP PAD TGP 1500 is a thermally conductive, un-reinforced gap-filling material designed for thermal management applications. It is made of silicone and features natural tack on both sides, allowing for good compliance with adjacent surfaces and minimizing interfacial resistance.

Key Features & Benefits:

  • Thermal Conductivity: 1.5 W/m-K
  • Un-reinforced for additional compliance
  • Soft, conformable, and low hardness
  • Electrically isolating
  • Operating Temperature Range: -60°C to 200°C

2. Applications

  • Telecommunications
  • Computers & peripherals
  • Power conversion
  • RDRAM™ memory modules / chip scale packages
  • Heat dissipation to chassis or heat spreaders

3. Typical Properties

Physical Properties

Property Test Method Value
Hardness (Shore 00, 30s delay) ASTM D2240 40
Heat Capacity ASTM E1269 1.0 J/g-K
Density ASTM D792 2.1 g/cc
Flammability UL 94 V-0
Young’s Modulus ASTM D575 310 kPa (45 psi)

Electrical Properties

Property Test Method Value
Dielectric Breakdown Voltage ASTM D149 >6,000 VAC
Dielectric Constant (1,000Hz) ASTM D150 5.5
Volume Resistivity ASTM D257 1 × 10¹¹ ohm-m

Thermal Properties

Property Test Method Value
Thermal Conductivity ASTM D5470 1.5 W/m-K
Thermal Impedance (0.040 inch) ASTM D5470 1.62°C-in²/W (10% Deflection)
1.5°C-in²/W (20% Deflection)
1.33°C-in²/W (30% Deflection)

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