Industries

BERGQUIST SIL PAD TSP 1500 (Known as BERGQUIST SIL-PAD 1500)

  • Item Name: BERGQUIST SIL PAD TSP 1500 (Known as BERGQUIST SIL-PAD 1500)
  • Manufacturer: Henkel
  • Product Category: Thermal Interface Material
  • Technologies: Silicone, Fiberglass Reinforced
  • Applications: Thermal management, electrically insulating, thermally conductive material for power electronics
  • Color: Green
  • Cure Type: Not applicable (pre-cured pad)
  • Package Size: Contact Avantek for details.
  • Shelf Life: Contact Avantek for details.

BERGQUIST SIL PAD TSP 1500

1. Product Overview

BERGQUIST SIL PAD TSP 1500 is an electrically insulating and thermally conductive elastomeric material reinforced with fiberglass. It is designed for high-reliability electronic packaging applications and features conformability, grease-free performance, and a wide operating temperature range of -60 to 200ºC.

2. Applications

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors

3. Typical Properties

Property Test Method Value
Physical Properties
Hardness (Shore A) ASTM D2240 80
Breaking Strength (KN/m) ASTM D1458 12
Elongation (%) ASTM D412 20
Tensile Strength (MPa) ASTM D412 7
Flammability Rating UL 94 V-0
Electrical Properties
Dielectric Breakdown Voltage (VAC) ASTM D149 4,000
Dielectric Constant @ 1,000 Hz ASTM D150 4.0
Volume Resistivity (ohm-meter) ASTM D257 1×10¹¹
Thermal Properties
Thermal Conductivity (W/m-K) ASTM D5470 2.0
Thermal Performance vs. Pressure
TO-220 Thermal Performance (ºC/W) @ 10 psi 3.54
TO-220 Thermal Performance (ºC/W) @ 25 psi 3.18
TO-220 Thermal Performance (ºC/W) @ 50 psi 2.68
TO-220 Thermal Performance (ºC/W) @ 100 psi 2.4
TO-220 Thermal Performance (ºC/W) @ 200 psi 2.22
Thermal Impedance (ºC-in²/W) @ Different Pressures
10 psi ASTM D5470 0.72
25 psi ASTM D5470 0.57
50 psi ASTM D5470 0.46
100 psi ASTM D5470 0.38
200 psi ASTM D5470 0.32

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