
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
BERGQUIST SIL PAD TSP 1500 is an electrically insulating and thermally conductive elastomeric material reinforced with fiberglass. It is designed for high-reliability electronic packaging applications and features conformability, grease-free performance, and a wide operating temperature range of -60 to 200ºC.
| Property | Test Method | Value |
|---|---|---|
| Physical Properties | ||
| Hardness (Shore A) | ASTM D2240 | 80 |
| Breaking Strength (KN/m) | ASTM D1458 | 12 |
| Elongation (%) | ASTM D412 | 20 |
| Tensile Strength (MPa) | ASTM D412 | 7 |
| Flammability Rating | UL 94 | V-0 |
| Electrical Properties | ||
| Dielectric Breakdown Voltage (VAC) | ASTM D149 | 4,000 |
| Dielectric Constant @ 1,000 Hz | ASTM D150 | 4.0 |
| Volume Resistivity (ohm-meter) | ASTM D257 | 1×10¹¹ |
| Thermal Properties | ||
| Thermal Conductivity (W/m-K) | ASTM D5470 | 2.0 |
| Thermal Performance vs. Pressure | ||
| TO-220 Thermal Performance (ºC/W) @ 10 psi | 3.54 | |
| TO-220 Thermal Performance (ºC/W) @ 25 psi | 3.18 | |
| TO-220 Thermal Performance (ºC/W) @ 50 psi | 2.68 | |
| TO-220 Thermal Performance (ºC/W) @ 100 psi | 2.4 | |
| TO-220 Thermal Performance (ºC/W) @ 200 psi | 2.22 | |
| Thermal Impedance (ºC-in²/W) @ Different Pressures | ||
| 10 psi | ASTM D5470 | 0.72 |
| 25 psi | ASTM D5470 | 0.57 |
| 50 psi | ASTM D5470 | 0.46 |
| 100 psi | ASTM D5470 | 0.38 |
| 200 psi | ASTM D5470 | 0.32 |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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