BERGQUIST SIL PAD TSP Q2500

(Also known as BERGQUIST Q-PAD II)

1. Product Overview

BERGQUIST SIL PAD TSP Q2500 is a composite thermal interface material designed to replace thermal grease. It consists of aluminum foil coated on both sides with thermally and electrically conductive Sil-Pad rubber. The material enhances heat transfer and eliminates issues associated with grease, such as contamination and dust collection.

• Technology: Silicone
• Appearance: Black
• Reinforcement Carrier: Aluminum
• Total Thickness: 0.152 mm (ASTM D374)
• Operating Temperature Range: -60°C to 180°C

2. Applications

• Between a transistor and a heat sink
• Between two large surfaces (e.g., L-bracket and chassis)
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices (e.g., resistors, transformers, solid-state relays)