
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
– Item Name: BERGQUIST GAP FILLER TGF 1000SR
– Manufacturer: Henkel
– Product Category: Thermally Conductive Liquid Gap Filler
– Technologies: Silicone-based, thermally conductive, two-part liquid gap filler
– Applications: Automotive electronics (HEV, NEV, batteries), computer peripherals, semiconductor and heat sink interface, telecommunications
– Color: Part A: Violet, Part B: White, Cured: Violet
– Cure Type: Room temperature cure or heat cure
– Package Size: Contact Avantek for details.
– Shelf Life: 6 months
BERGQUIST GAP FILLER TGF 1000SR is a two-part, thermally conductive liquid gap filler designed for superior slump resistance. It cures at room temperature or can be heat-accelerated, forming a soft, thermally conductive elastomer. The material provides excellent conformability for low-stress applications and does not produce cure by-products.
Key Features & Benefits:
| Property | Test Method | Value |
|---|---|---|
| Viscosity @ 4,500 s⁻¹ | ASTM D5099 | 20,000 mPa·s (cP) |
| Density | ASTM D792 | 2.0 g/cc |
| Mix Ratio (by weight & volume) | – | 1:1 |
| Pot Life @ 25°C | ARES Rheometer | 60 min |
| Shelf Life @ 25°C | – | 180 days |
| Temperature | Time |
|---|---|
| Room Temp (25°C) | 20 hours |
| Heat Cure (100°C) | 10 minutes |
| Property | Test Method | Value |
|---|---|---|
| Hardness (Shore 00) | ASTM D2240 | 75 |
| Heat Capacity | ASTM E1269 | 1.0 J/g-K |
| Flammability | UL 94 | V-0 |
| Property | Test Method | Value |
|---|---|---|
| Dielectric Strength | ASTM D149 | 500 V/mil |
| Dielectric Constant (1,000 Hz) | ASTM D150 | 5.1 |
| Volume Resistivity | ASTM D257 | 1×10¹¹ ohm-meter |
| Property | Test Method | Value |
|---|---|---|
| Thermal Conductivity | ASTM D5470 | 1.0 W/m-K |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
Office address: The Verosa Park, 39 street 10, Quarter 2, Long truong Ward, Ho Chi Minh City, Viet Nam
Website: avantek.vn
Email 1: info@avantek.vn
Email 2: long.pham@avantek.vn
Tel: (+84) 944 415 762
Copyright © AVANTEK VN CO., LTD
Leave your information or contact via Hotline, our Customer Support Technical team will contact you immediately!