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BERGQUIST GAP FILLER TGF 1500LVO

  • Item Name: BERGQUIST GAP FILLER TGF 1500LVO
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Liquid Gap Filler
  • Technologies: Silicone-based, Low Volatility, Thermally Conductive
  • Applications: Lighting, Automotive Electronics (HEV, NEV, Batteries), Silicone-Sensitive Electronics
  • Color: Yellow (Cured), Yellow (Part A), White (Part B)
  • Cure Type: Room Temperature or Heat Cure
  • Package Size: Contact Avantek for details.
  • Shelf Life: 6 months

1. Product Overview

BERGQUIST GAP FILLER TGF 1500LVO is a thermally conductive, liquid gap filler with low volatility, designed for silicone-sensitive applications. It cures at room temperature or with heat and provides a soft, thermally conductive elastomer for fragile assemblies and complex air gaps.

  • Technology: Silicone
  • Cure Type: Room temperature or heat cure
  • Color: Part A – Yellow, Part B – White
  • Mix Ratio (by weight & volume): 1:1
  • Operating Temperature Range: -60 to 200°C
  • Key Benefits:
    • Thermal conductivity: 1.8 W/m-K
    • Low siloxane outgassing
    • 100% solids – no cure by-products
    • Conforming and excellent wet-out properties
    • Stable at low and high temperatures

2. Applications

  • Lighting
  • Automotive electronics (HEV, NEV, batteries)
  • Silicone-sensitive electronics

3. Typical Properties

Uncured Properties

Property Test Method Value
Viscosity (High Shear) ASTM D5099 20,000 mPa·s (cP)
Density ASTM D792 2.7 g/cc
Working Time @ 25°C Rheometer Test 120 minutes
Shelf Life @ 25°C 180 days

Cure Schedule

Temperature Time
25°C 8 hours
100°C 10 minutes

Cured Properties

Property Test Method Value
Hardness (Shore 00) ASTM D2240 80
Heat Capacity ASTM E1269 1.0 J/g-K
Flammability UL 94 V-0
Siloxane Content (ΣD4-D10) <100 ppm

Electrical Properties

Property Test Method Value
Dielectric Strength ASTM D149 400 V/mil
Dielectric Constant @ 1,000 Hz ASTM D150 6.2
Volume Resistivity ASTM D257 1×10¹⁰ ohm-meter

Thermal Properties

Property Test Method Value
Thermal Conductivity ASTM D5470 1.8 W/m-K

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