Applications

LOCTITE 3627

  • Item Name: LOCTITE 3627
  • Manufacturer: Henkel
  • Product Category: Surface Mount Adhesive
  • Technologies: One-component epoxy (no mixing required)
  • Applications: Bonding SMD components to PCBs and small parts; suitable for high dispense speeds and stencil print applications, including lead-free processes
  • Color: Red gel-like (uncured)
  • Cure Type: Heat cure
  • Package Size: Contact Avantek for details.
  • Shelf Life: Contact Avantek for details.

1. Product Overview

  • Technology: Epoxy
  • Type: One-component, heat-curing adhesive
  • Appearance: Red gel-like material
  • Key Features: High dispense speeds, high dot profile, strong wet strength, good electrical characteristics
  • Application Method: Syringe dispensing and stencil printing

2. Applications

  • Bonding surface-mounted devices (SMDs) to PCBs before wave soldering
  • Small parts bonding
  • Compatible with lead-free soldering processes (water and alcohol-based fluxes)

3. Typical Properties

Uncured Properties
Property Value
Specific Gravity (@ 25°C) 1.3
Particle Size (µm) <100
Yield Point (Pa) 100 to 275
Casson Viscosity (@ 25°C, Pa·s) 2 to 5
Curing Performance
  • Recommended curing: 90–120 sec @ 150°C
  • Curing conversion: ≥75% after 5 min @ 125°C
Cured Properties
Property Value
Thermal Expansion (K⁻¹) 75 × 10⁻⁶ (26–56°C), 111 × 10⁻⁶ (90–150°C)
Thermal Conductivity (W/m·K) 0.3
Glass Transition Temperature (°C) 105
Volume Resistivity (Ω·cm) 62 × 10¹⁵
Surface Resistivity (Ω) 19 × 10¹⁵
Adhesion & Strength
Test Value
Pull-off Strength (C-1206 on FR4, N) 58 (13 lb)
Push-off Strength (C-1206 on FR4, N) ≥27.5 (≥6.1 lb)
Torque Strength (N·mm) 55 (10.5 in·oz)
Lap Shear Strength (Steel, N/mm²) ≥13.5 (≥1,957 psi)
Environmental Resistance
  • Hot Solder Dip (260°C for 10 sec): Pass
  • Lead-free solder resistance: No component loss
  • Storage Conditions: 2°C to 8°C

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