FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Insulcast 116 FR is a room temperature curing, epoxy potting and casting compound with a 1:1 mix ratio (by weight or volume), making it ideal for high-volume production use. It is UL recognized (File E86165) and meets UL94V-0 flame retardancy requirements. This material has been formulated to minimize health risks while maintaining excellent electrical insulation and mechanical strength.
✅ Flame Retardant: UL94V-0 rated for fire safety.
✅ Easy 1:1 Mixing Ratio: Suitable for manual or automated dispensing.
✅ Room Temperature Cure: Cures in 16-24 hours at ambient temperature.
✅ Durable & Insulating: Provides high dielectric strength and mechanical resistance.
✅ Low Health Risk: Formulated to reduce respiratory, skin, and eye irritation.
🔹 Electronic Encapsulation: Used for potting transformers, capacitors, and circuit boards.
🔹 Industrial Bonding & Casting: Suitable for structural potting and general industrial applications.
🔹 Automotive & Aerospace: Ideal for vibration-dampening and high-temperature insulation.
🔹 Flame-Retardant Coatings: Provides fire protection for electrical components.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Black | Cream | – | – |
| Viscosity (cP) | 7,200 | 11,000 | 8,100 | ASTM D2393 |
| Specific Gravity | 1.50 | 1.45 | – | – |
| Mix Ratio (by Weight/Volume) | 1:1 | – | – | – |
| Pot Life (100g mass) | – | – | 1.5 hours | – |
| Gel Time (25°C) | – | – | 3-4 hours | – |
| Shelf Life | 12 months | – | – | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore D) | 75 | ASTM D2240 |
| Compressive Strength (psi / MPa) | 12,500 / 86.2 | ASTM D695 |
| Tensile Strength (psi / MPa) | 9,500 / 65.5 | ASTM D638 |
| Flexural Strength (psi / MPa) | 10,000 / 69.0 | ASTM D790 |
| Tensile Elongation (%) | 8 | ASTM D638 |
| Coefficient of Thermal Expansion | 30 × 10⁻⁶ m/mK | – |
| Thermal Conductivity (W/m·K) | 0.65 | – |
| Flammability Rating | UL94V-0 Pass | – |
| Heat Distortion Temperature (°C) | 70 | – |
| Service Temperature (°C) | -40 to 105 | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 420 | ASTM D149 |
| Dielectric Constant (1 kHz) | 4.4 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.02 | ASTM D150 |
| Volume Resistivity (ohm·cm) | 1 × 10¹⁴ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 16-24 hours at 22°C (72°F) |
| Accelerated Cure | 2 hours at 22°C (72°F) + 2 hours at 55°C (131°F) |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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