FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Insulcast
Package Sizes:
Shelf Life:
Product Description: Insulcast 333 is a moderate viscosity, self-extinguishing epoxy potting and casting compound that conforms to Underwriters Laboratories Flame Class 94V-0 standards. It offers high mechanical strength, excellent electrical insulation, and superior thermal resistance. The system can be cured at room temperature or accelerated with heat, making it suitable for potting, encapsulation, and protective coatings applications.
Key Features:
Recommended Applications:
| Property | Insulcast 333 | Insulcure 9 | Insulcure 20 | Insulcure 11B | Test Standard |
|---|---|---|---|---|---|
| Color | Black | Amber | Amber | Amber | – |
| Viscosity (cP) | 13,000 | 55 | 700 | 700 | ASTM D2393 |
| Specific Gravity | 1.55 | 0.97 | 0.98 | 0.95 | – |
| Mix Ratio (by Weight) | 100:6 | 100:12-16 | 100:8 | – | – |
| Mixed Viscosity (cP) | 2,000 | 3,000 | 3,000 | – | ASTM D2393 |
| Pot Life (100g mass, min) | 45 | 60 | 300 | – | – |
| Property | Insulcure 9 | Insulcure 20 | Insulcure 11B | Test Standard |
|---|---|---|---|---|
| Hardness (Shore D) | 85 | 85 | 85 | ASTM D2240 |
| Tensile Strength (psi) | 11,500 | 11,500 | 12,000 | ASTM D638 |
| Tensile Elongation (%) | 2.75 | 2.75 | 3.75 | ASTM D638 |
| Flexural Strength (psi) | 17,500 | 17,500 | 19,500 | ASTM D790 |
| Compressive Strength (psi) | 14,000 | 14,000 | 14,500 | ASTM D695 |
| Coefficient of Thermal Expansion (°C) | 48×10⁻⁶ | 48×10⁻⁶ | 48×10⁻⁶ | – |
| Thermal Conductivity (BTU-in/(ft²)(hr)(°F)) | 4.3 | 4.3 | 4.2 | – |
| Flammability Rating | Pass | Pass | Pass | UL 94V-0 |
| Heat Distortion Point (°C) | 80 | 80 | 155 | – |
| Service Temperature (°C) | -40 to 105 | -40 to 105 | -55 to 155 | – |
| Property | Insulcure 9 | Insulcure 20 | Insulcure 11B | Test Standard |
|---|---|---|---|---|
| Dielectric Strength (V/mil) | 410 | 410 | 430 | ASTM D149 |
| Dielectric Constant (1 kHz) | 4.4 | 4.4 | 4.5 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.02 | 0.02 | 0.02 | ASTM D150 |
| Volume Resistivity (ohm-cm) | 1×10¹⁵ | 1×10¹⁵ | 1×10¹⁵ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Insulcure 9 & 20 | 8-12 hours at 25°C (77°F) or 2 hours at 50°C (122°F) |
| Insulcure 11B | 2 hours at 100°C (212°F) for masses < ½ lb. For > ½ lb., cure 2 hours at 80°C (176°F) + 2 hours at 100°C (212°F). Post cure 1 hour at 150°C (302°F) for high-temperature applications. |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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