Applications

DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler

  • Technology: Thermally Conductive Silicone Gap Filler
  • Brand Name: DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Avantek for details.
  • Shelf Life: 9 months

DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler:


1. Product Overview

DOWSIL™ TC-5515 LT is a two-part, thermally conductive silicone gap filler with a thermal conductivity of 2.0 W/m·K. It offers low density, soft compliance, and stress relief, making it suitable for dissipating heat in electronic devices. The material cures at room temperature but can be heat-accelerated for faster curing. Once cured, it maintains a tacky surface for easy rework and holds its position in vertical applications.

Key Features & Benefits:
✔ Thermal conductivity: 2.0 W/m·K
Soft and compliant, providing stress relief and vibration absorption
Non-flowable after dispensing, holds position in vertical applications
Room-temperature curing with an optional heat-accelerated cure
Surface tacky after curing for easy rework
UL 94 V0 flame retardancy


2. Applications

DOWSIL™ TC-5515 LT is designed for heat dissipation in electronic and electrical applications, particularly in:

  • EV battery modules and control unit modules
  • Printed circuit boards (PCBs)
  • Other heat-generating electronic components
  • Automotive and industrial power electronics

This gap filler enhances thermal management by ensuring efficient heat transfer between heat sources (such as EV modules) and heat sinks (such as aluminum housings).

3. Typical Properties

Before Mixing (Individual Parts A & B)

Property Unit Part A Part B
Color White Blue
Viscosity @ 10 s⁻¹ Pa·s 150 120
Specific Gravity 1.95 1.95
Mix Ratio (Weight/Volume) 1:1 1:1

After Mixing & Curing

Property Unit Mixed Material Cured Material
Viscosity @ 10 s⁻¹ Pa·s 140
Thixotropic Index 3.5
Working Time (25°C) Min 90
Cure Time (25°C) Min 360
Cure Time (80°C) Min 30
Durometer Hardness Shore 00 65
Thermal Conductivity W/m·K 2.00
Dielectric Strength kV/mm 19.0
Volume Resistivity Ohm·cm ≥1.0E+13
Dielectric Constant (100 KHz) 3.0
Dissipation Factor (100 KHz) 0.0087
Lap Shear Strength (Al/Al) MPa 0.20
Shear Modulus (DMA) MPa 0.27
CTE (-40 to 150°C) ppm/K 132
Minimum Bond Line Thickness μm 142 (0.14 MPa), 127 (0.42 MPa)
UL Flame Classification UL 94 V0
Shelf Life (25°C) Months 9

Everwide FX244-1: High Performance for Precision Molding

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

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