DOWSIL™ TC-6040 Thermal Conductive Encapsulant:
DOWSIL™ TC-6040 is a two-part, flowable silicone encapsulant with high thermal conductivity (4.0 W/m·K). It cures at room temperature and can be heat-accelerated for faster processing. The encapsulant provides self-leveling properties, minimal filler settling, and excellent long-term stability, making it suitable for demanding electronic applications.
DOWSIL™ TC-6040 is used in various electronics and power applications, including:
| Property | Result | Unit | Comments |
|---|---|---|---|
| Mixing Ratio (A:B) | 1:1 | – | Base to curing agent |
| Color (Part A/Base) | White | – | – |
| Color (Part B/Curing Agent) | Pink | – | – |
| Color (Mixed/Dispensed) | Pink | – | – |
| Specific Gravity (A, B, Mixed) | 3.05 | – | – |
| Viscosity (Part A, 25°C) | 26,000 | cP | Shear rate 1/S-1 |
| Viscosity (Part B, 25°C) | 22,000 | cP | Shear rate 1/S-1 |
| Viscosity (Mixed, 25°C) | 25,000 | cP | Shear rate 1/S-1 |
| Working Life (Pot Life, 25°C) | 90 | minutes | Time to viscosity double |
| Cure Time (25°C) | 24 | hours | – |
| Cure Time (100°C) | 60 | minutes | – |
| Hardness (Shore A, 100°C cure) | 32 | A | – |
| Tensile Strength | 0.26 | MPa | – |
| Elongation | 10 | % | – |
| Lap Shear Adhesion (AlClad) | 0.10 | MPa | Unprimed adhesion |
| Dielectric Strength | 15 | kV/mm | 1.0 mm thickness |
| Volume Resistivity | ≥ 1.0E+13 | ohm·cm | Non-dried |
| Dielectric Constant (100KHz) | 4.13 | – | – |
| Dissipation Factor (100KHz) | 0.018 | – | – |
| Thermal Conductivity | 4.0 | W/m·K | Measured via Hot Disk |
| Linear Coefficient of Thermal Expansion (CTE) | 100 | ppm | -40°C to 150°C |
| Heat Capacity (25°C) | 0.90 | J·C/g | – |
| Heat Capacity (100°C) | 1.09 | J·C/g | – |
| Heat Capacity (150°C) | 1.22 | J·C/g | – |
| Low Molecular Siloxane Content (D4-D10) | 131 | ppm | Cured sample |
| Flammability Rating | UL 94 V0 | – | – |
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