TIA268GF (XE14-C7413) is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. XE14-C7413 can be used as liquid dispensed alternative to prefabricated Thermal Pads, for a broad array of thermal designs in electronic applications.
Key Features
• High thermal conductivity
• Fast, low temperature cure
• Convenient 1:1 mix ratio by weight
• Retains softness after cure to contribute to stress relief during thermal cycling
• Good slump resistance (stays in place)
• Repairable
Applications
Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.
| Đặc điểm | (XE14-C7413) A | (XE14-C7413) B |
| Màu (Part A & B) | hồng | hồng nhạt |
| Độ nhớt *1 | 240 | 255 |
| Tỷ lệ trộn theo trọng lượng | 1:1 | 1:1 |
| Độ nhớt sau khi trộn | 250 | 250 |
| Chỉ số lưu biến | 1.5 | 1.5 |
| Thời gian thao tác @ 23°C (giờ) | 1 | 1 |
| Điều kiện khô (giờ) @ 70°C @ 23°C |
1 24 |
1 24 |
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