TIA223G-DG is a 2-component, thermally conductive material for encapsulating, gap filling, and for use as a thermal path to heat sinks. The flowability of TIA223G-DG allows it to conform to complex 3-dimensional shapes and cavities in potting applications, while also enabling it to be transferred in a thin layer as a liquid-dispensed alternative to thermal pads.
TIA223G-DG quickly cures to a soft rubber gel with exposure to heat and will also cure at room temperatures.
KEY FEATURES
• Good thermal conductivity
• Fast cure with exposure to heat
• Easy to use 1:1 mixing ratio by weight or volume
APPLICATIONS
Thermal encapsulating, gap filling, and thermal interface to heat sinks in various electronic
components.
| Đặc điểm | Gía trị |
| Tỷ lệ trộn | 1:1 |
| Màu | Xám đậm |
| Điều kiện khô đề xuất | 0.5h @ 70°C 24h @ RT |
| Độ nhớt [Pas] |
40 |
| Thời gian thao tác @RT [h] | 0.5 |
| Độ cứng [Thước A] | 20 |
| T/C [Wm/K] |
2.1 |
| Độ bền điện môi [kV/mm] |
20 |
| Nhiệt độ hoạt động | -40°C to 200°C |
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