XE14-TM009 is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. XE14-TM009 can be used as liquid dispensed alternative to prefabricated Thermal Pads, for a broad array of thermal designs in electronic applications.
KEY FEATURES
• High thermal conductivity
• Fast, low temperature cure
• Convenient 1:1 mix ratio by weight
• Retains softness after cure to contribute to stress relief during thermal cycling
• Good slump resistance (stays in place)
• Repairable
APPLICATIONS
Thermal interface for electronic components in Automotive, Consumer, Telecommunication,
Lighting and Industrial applications
| Đặc điểm | XE14-TM009 (A) | XE14-TM009 (B) |
| Màu (Part A & B) | hồng | hồng nhạt |
| Độ nhớt *1 | 240 | 235 |
| Tỷ lệ trộn theo trọng lượng | 1:1 | 1:1 |
| Độ nhớt sau khi trộn | 275 | 275 |
| Chỉ số lưu biến | 2.6 | 1.3 |
| Thời gian thao tác @ 23°C (giờ) | 1 | 1 |
| Điều kiện khô (giờ) @ 70°C @ 23°C |
1 24 |
1 24 |
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As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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