
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
Micares® X1087RD resin (R10)/ P 978
Micares® X1087RD resin (R10) combined with hardener P 978 is a two‑component, flame‑retardant polyurethane potting system. It is designed for electrical and electronics applications where a flexible, low‑emission, and chemical‐resistant encapsulant is required. The resin is a filled polyurethane (PUR) system (red in color) and is provided pre‑degassed, while the hardener is an unfilled, modified MDI (brown in color). The system is UL 94 V‑0 listed with an electrical RTI of 130 °C and is formulated to cure at ambient temperature (above 18°C) without the need for pre-heating of components or molds.
| Property | Test Conditions/Method | Value | Unit |
|---|---|---|---|
| Resin Component Viscosity | 25°C, EN13702-2 (IO-10-50) | 3,000 – 6,000 | mPas |
| Resin Density | 25°C, ASTM D 1475 (IO-10-51) | 1.40 – 1.45 | g/mL |
| Mixing Ratio (Weight) | For 100 g resin | 100 : 20 | g (resin : hardener) |
| Mixing Ratio (Volume) | For 100 mL resin | 100 : 25 | mL (resin : hardener) |
| Initial Mixture Viscosity | 25°C, EN13702-2 (IO-10-50) | 1,800 – 2,800 | mPas |
| Pot Life | 25°C (doubled viscosity) | 15 – 25 | minutes |
| 40°C | 8 – 14 | minutes | |
| Gelation Time | 25°C, 15 mL sample (IO-10-73) | 2.0 – 3.0 | hours |
| Demoulding Time | 25°C, 15 mL sample (IO-10-73) | 7 – 9 | hours |
| Cured System Hardness | 25°C, ASTM D 2240 (IO-10-58) – Shore A | 85 – 90 | Shore A |
| 25°C, ASTM D 2240 – Shore D | 55 – 60 | Shore D | |
| Glass Transition (Tg) | ASTM D 3418 (IO-10-69) | -5 – 5 | °C |
| Max Recommended Operating Temperature | IEC 60085 | 130 | °C |
| Dielectric Strength | ASTM D 149 (IO-10-61) | 21 – 24 | kV/mm |
| Tensile Strength | ASTM D 638 (IO-10-63) | 4 – 6 | MN/m² |
| Elongation at Break | ASTM D 638 (IO-10-63) | 50 – 60 | % |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

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Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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