Momentive’s thermally conductive gap fillers are non-slumping, dispensable materials that can be applied to gaps to create a heat path. These non-adhesive curing type TIMs form a soft, stress-absorbing thermal interface. In addition to filling gaps in electronic components, they are also applied to flat or high-profile 3-dimensional surfaces as a cured-in-place thermal pad or as a pump-out resistant alternative to greases.

FEATURES:

• High thermal conductivity (10.1 W/m.K)
• Dispensable formulation that conforms to complex shapes.
• Soft, stress-absorbing
• Electrically insulative
• Repairable
• Ability to remain in place under thermal cycling scenarios
  ✓ No-sag
  ✓ No crack
  ✓ No voiding