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Thermally Conductive Material SilCool™ TIA208R

  • Product code: SilCool™ TIA208R
  • Manufacturer: Momentive
  • Package size: contact us for details
  • Shelf Life: contact us for details

SilCool™ TIA208R is a two-component, thermally conductive silicone material designed for potting and gap filling applications. When cured—either at room temperature or with heat—it forms a thermally conductive rubber that adheres well to most metals and plastics without requiring a primer.

Its flowability allows it to conform to complex three-dimensional shapes and cavities, ensuring voids are filled and heat is effectively dissipated.


Key Features & Benefits:

  • Primerless adhesion to metals and plastics
  • Good thermal conductivity (0.7 W/m·K)
  • 1:1 mixing ratio for easy use
  • Cures at room temperature (23°C in 24h) or faster with heat (70°C in 30 min)
  • Flame retardant (UL94 V-0 certified)
  • Operates in temperatures ranging from -40°C to 150°C

Potential Applications:

  • Thermal potting for power supplies
  • LED driver encapsulation
  • Ballasts and other electronic devices
Property Value
Uncured Properties (23°C, 50%RH)
Appearance Black (Part A), Light Gray (Part B)
Viscosity (Pa·s) 4.0 (A), 3.8 (B)
Mixing Ratio (by weight) 1:1
Mixed Viscosity (Pa·s) 4.2
Workable Life (min) 90
Flowable Life (min) 30
Curing Conditions
Heat Cure 70°C for 30 min
Room Temperature Cure 23°C for 24 hours
Cured Properties (70°C, 30 min Cure)
Appearance Thermally conductive rubber, Black
Density (g/cm³) 1.6
Hardness (Type A) 40
Thermal Conductivity (W/m·K) 0.7
Tensile Strength (MPa) 1.6
Lap Shear Adhesion Strength (Al) (MPa) 1.5
Lap Shear Adhesion Strength (PC) (MPa) 0.9
Volume Resistivity (MΩ·m) 8.0 × 10⁶
Dielectric Strength (kV/mm) 25
Dielectric Constant (60Hz) 3.3
Dissipation Factor (60Hz) 0.016
UL Flame Retardancy V-0 (UL94)
UL RTI Rating (°C) 150

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