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TECHNOMELT® PA 6771 BLACK

  • Item Name: TECHNOMELT® PA 6771 BLACK
  • Manufacturer: Henkel Corporation
  • Product Category: Hot Melt Adhesives
  • Technologies: Polyamide hot melt adhesive technology
  • Applications: Molding applications such as potting electronics modules, molding strain relief in wiring, and encapsulating sensors; adheres well to substrates like FR4, metals, and plastics (e.g., ABS, PC)
  • Color: Black
  • Cure Type: Physical setting (solidifies upon cooling)
  • Package Size: Contact Avantek for details
  • Shelf Life: Contact Avantek for details

1. Product Overview

TECHNOMELT® PA 6771 BLACK is a one-component polyamide hot melt adhesive designed for low-pressure molding applications. It has low viscosity, making it suitable for encapsulating fragile components without damage. Once applied, it forms a protective barrier for electronics, offering resilience, heat stability, and moisture resistance.

Key Features

  • Low molding pressure & easy moldability
  • Excellent UV stability (suitable for outdoor use)
  • Encapsulation of sensitive components
  • Adheres to FR4, metals, and plastics (ABS, PC, etc.)

2. Applications

  • Encapsulation of electronic modules
  • Molding strain relief into wiring
  • Encapsulation of sensors

3. Typical Properties

Property Value Test Standard
Specific Gravity @ 20°C 1.01 g/cm³ ISO 1183-1
Softening Point 188°C ASTM E28
Melt Viscosity @ 210°C 8,475 mPa·s ASTM D3236

After Curing

Property Value Test Standard
Shore Hardness (Durometer D) 29 ISO 868
Elongation 500% ISO 527
E-Modulus 66 N/mm² (9,570 psi) ASTM D638
Tensile Strength 6.4 N/mm² (435 psi) ISO 527
Yield Strength 4.6 N/mm² (667 psi) ISO 527
Low Temp. Flexibility -45°C ASTM D3111
Glass Transition Temp. (Tg) -55°C DSC Second Run

Storage & Handling

  • Store at ≤28°C in a dry, sealed container.
  • Avoid heating above application temperature (210°C – 240°C).

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