Applications

TECHNOMELT PA 657 N BLACK

  • Item Name: TECHNOMELT® PA 657 N BLACK
  • Manufacturer: Henkel
  • Product Category: Polyamide Hot Melt Adhesive
  • Technologies: Low-pressure molding, thermoplastic encapsulation
  • Applications: Encapsulation of electronics, strain relief for wiring, sensor molding
  • Color: Black
  • Cure Type: Physical setting
  • Package Size: Contact Avantek for details.
  • Shelf Life: Contact Avantek for details.

1. Product Overview

TECHNOMELT® PA 657 N BLACK is a polyamide hot melt adhesive designed for low-pressure molding applications. It offers:

  • Low viscosity for easy moldability.
  • Good heat stability and moisture resistance.
  • Resilient encapsulation for electronic components.
  • Compatibility with substrates like FR4, metals, ABS, and PC plastics.

2. Applications

  • Potting and encapsulation of electronic modules.
  • Molding strain relief into wiring.
  • Encapsulation of sensors.

3. Typical Properties

Property Value Test Method
Viscosity (mPa·s) @180°C: 8,600 @190°C: 6,500 @200°C: 4,900 @210°C: 3,000-4,500 ASTM D3236
Shore Hardness (A) 77 DIN EN ISO 868/15s
Elongation (%) 350 ISO 527
E-Modulus (N/mm²) 25 (3,625 psi) ASTM D638
Low Temp. Flexibility (°C) -50 ASTM D3111
Temp. Creep Resistance (°C) 125 Henkel MH 11
Glass Transition Temp. (Tg, °C) -45 DSC Second Run
Water Absorption (% at 23°C, 1 day) 1.4
Tensile at Break (N/mm²) 2.7 (390 psi) ISO 527
Yield Strength (N/mm²) 2.6 (375 psi) ISO 527
Specific Gravity @ 20°C (g/cm³) 0.98 ISO 1183-1
Softening Point (°C) 150-165 ASTM E28
Dielectric Constant / Dissipation Factor @1MHz: 4.1/0.105 @1GHz: 2.8/0.038 @1.8GHz: 2.7/0.029 Open-ended coaxial probe
Dielectric Strength (kV/mm) 15 IEC 60243
Volume Resistivity (ohm-cm) 0.6 × 10¹² DIN IEC 60093
Comparative Tracking Index (V) 600 IEC 60112

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