FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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RTVS 8128 is a low-viscosity, flame-retardant, general-purpose, reversion-resistant RTV silicone. It combines low-temperature flexibility, excellent electrical properties, and high-temperature resistance, making it suitable for potting and casting applications. This material also allows easy removal for component replacement or repair and meets the UL 94V-0 flame retardant standard.
✅ Low Viscosity: Ensures easy flow into complex geometries.
✅ UL 94V-0 Flame Retardant: Complies with stringent fire safety regulations.
✅ Reversion Resistant: Maintains mechanical integrity over time.
✅ Fast Cure Capability: Cures rapidly at elevated temperatures for quick processing.
✅ Good Electrical Insulation: Provides high dielectric strength and volume resistivity.
🔹 Electronic Potting & Casting: Protects transformers, sensors, and circuit boards.
🔹 Automotive & Aerospace Electronics: Provides thermal and electrical insulation.
🔹 Encapsulation Applications: Ensures reliable protection for sensitive components.
🔹 Industrial Equipment: Used in high-performance electronics and power systems.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Dark Gray | Buff (Neutral) | – | Visual |
| Viscosity (cP) | 2,000 | 2,000 | 2,200 | ASTM D1084 |
| Specific Gravity | 1.38 | 1.31 | – | – |
| Mix Ratio (by Weight) | 1:1 | – | – | – |
| Mix Ratio (by Volume) | 1:1 | – | – | – |
| Pot Life (100g mass) | 60-90 min | – | – | – |
| Gel Life @ 25°C (mins) | 240-360 | – | – | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore A) | 50 | ASTM D2240 |
| Tensile Strength (psi) | 500 | ASTM D412 |
| Tensile Elongation (%) | 135 | ASTM D412 |
| Tear Strength (Die B) (lb/in) | 18 | ASTM D624 |
| Coefficient of Thermal Expansion (°C⁻¹) | 22 × 10⁻⁵ | – |
| Thermal Conductivity (BTU-ft/(ft²·hr·°F)) | 0.18 | – |
| Thermal Conductivity (BTU-in/(ft²·hr·°F)) | 2.16 | – |
| Service Temperature Range (°C) | -55 to +204 | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 550 | ASTM D149 |
| Dielectric Constant (1 kHz) | 3.0 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.007 | ASTM D150 |
| Volume Resistivity (ohm-cm) | 1.5 × 10¹⁵ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 24 hours at 25°C (77°F) |
| Accelerated Cure | 4 hours at 60°C (140°F) |
| Rapid Cure | 1 hour at 90°C (194°F) |
| High-Speed Cure | 15 minutes at 120°C (248°F) |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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