
FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
Brand: Insulcast
Package Sizes: Contact us for details.
Shelf Life: 9 months
RTVS 42 CURTIS II is a low-viscosity silicone-epoxy copolymer designed to withstand severe thermal shock while providing low moisture absorption and excellent dielectric insulation. It is UL 94V-0 certified (File #E86165) and contains silane adhesion promoters, which improve bonding to metals and plastics. Its unique chemistry combines the low-temperature flexibility of silicones with the encapsulating performance of epoxies, making it ideal for demanding potting and casting applications.
✅ Low Viscosity: Ensures easy flow into complex geometries.
✅ Silicone-Epoxy Hybrid: Provides thermal shock resistance & encapsulation benefits.
✅ UL 94V-0 Flame Retardant: Meets fire safety requirements.
✅ Excellent Dielectric Insulation: Ensures high electrical reliability.
✅ Superior Adhesion: Bonds well to metals and plastics.
✅ Low Moisture Absorption: Ideal for harsh environmental conditions.
🔹 Potting & Encapsulation: Protects sensitive electronic components from moisture and temperature fluctuations.
🔹 Thermal Shock-Resistant Applications: Ensures reliable performance under extreme thermal cycling.
🔹 Automotive & Aerospace Electronics: Provides long-term durability in high-performance applications.
🔹 Industrial Power Systems: Used in power modules and high-voltage insulation applications.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Black | Amber | – | Visual |
| Viscosity (cP) | 18,000 | 125 | 16,000 | ASTM D1084 |
| Specific Gravity | 1.43 | 1.02 | – | – |
| Mix Ratio (by Weight) | 100:4.8 | – | – | – |
| Mix Ratio (by Volume) | 100:7 | – | – | – |
| Pot Life (100g mass) | <20 min | – | – | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore A) | 75 | ASTM D2240 |
| Hardness (Shore D) | 10-15 | ASTM D2240 |
| Tensile Strength (psi) | 900 | ASTM D412 |
| Tensile Elongation (%) | 175 | ASTM D412 |
| Tear Strength (Die B) (lb/in) | 40 | ASTM D624 |
| Glass Transition Temperature (Tg) (°C) | -60 | – |
| Shrinkage (%) | 0.2-0.5 | – |
| Coefficient of Thermal Expansion (°C⁻¹) | 45 × 10⁻⁶ | – |
| Thermal Conductivity (W/m·K) | 0.58 | – |
| Service Temperature Range (°C) | -55 to 125 (155°C intermittent use) | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 500 | ASTM D149 |
| Dielectric Constant (1 kHz) | 4.0 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.006 | ASTM D150 |
| Volume Resistivity (ohm-cm) | 1.0 × 10¹⁵ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 24 hours at 25°C (77°F) |
| Accelerated Cure | 8 hours at 25°C + 2 hours at 65°C |

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

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