Nitto Denko’s ELP UE-115AJR
Nitto Denko’s ELP UE-115AJR is a UV-expandable tape designed for semiconductor applications. It features excellent chipping performance, controlled adhesion reduction after UV irradiation, and compliance with the RoHS2 directive. The tape consists of a PVC base film, acrylic adhesive, and PET liner, ensuring high performance in wafer processing.
| Item | Unit | ELP UE-115AJR | ELP UE-115AJ (Current Item) |
|---|---|---|---|
| Appearance | – | Translucent | Translucent |
| Total Thickness | µm | 145 | 145 |
| Adhesive Thickness | µm | 10 | 10 |
| Base Film Thickness | µm | 135 | 135 |
| Adhesion to Si (before UV) | N/20mm | 9.0 | 9.0 |
| Adhesion to Si (after UV) | N/20mm | 0.2 | 0.2 |
| UV Irradiation Conditions | mJ/cm² | 460 (365nm high molecular lamp) | 460 (365nm high molecular lamp) |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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