TSE322SK Key Features & Benefits

✔ One-component system – No mixing required
✔ Fast cure at elevated temperatures – Short cure time at 150°C (1 hour)
✔ Primerless adhesion – Bonds to many substrates without primer
✔ High elongation – Absorbs stress and improves durability
✔ Non-corrosive – Safe for metals and sensitive substrates
✔ Excellent dielectric properties – Ideal for electrical insulation

TSE322SK Applications

• Encapsulation & Potting – Protects electronic components
• Bonding & Sealing – Works with various substrates
• Coating for Hybrid ICs & Printed Circuit Boards

Processing Recommendations

✔ Surface Preparation: Ensure surfaces are clean and dry before application.
✔ Cure Conditions: Requires elevated temperatures:

• 100°C: 4 hours
• 120°C: 2 hours
• 150°C: 1 hour
  ✔ Compatibility Test: Some materials (e.g., butyl rubber, amines, sulfur-containing compounds) may inhibit curing. Perform a test patch before full application.