TIA222G is a two-component, thermally conductive silicone material used for encapsulation, gap filling, and thermal transfer applications. It features flowability, allowing it to conform to complex three-dimensional shapes and cavities in potting applications.

This material cures to a soft rubber gel upon exposure to heat or room temperature, providing excellent thermal performance (2.2 W/m·K) while maintaining flame retardancy (UL94 V-0 certified).

Key Features & Benefits

✅ Good Thermal Conductivity (2.2 W/m·K) – Enhances heat dissipation for electronic components.
✅ Fast Heat Cure (70°C for 30 minutes) – Reduces processing time for manufacturing efficiency.
✅ Easy 1:1 Mixing Ratio – Ensures consistent application and reduced material waste.
✅ Flame Retardant (UL94 V-0 Certified) – Provides fire resistance for safety compliance.
✅ Soft Rubber Gel Curing – Offers flexibility and vibration damping.
✅ Low Volatile Siloxane (<200 ppm D3-D10) – Reduces contamination risk in sensitive applications.

Potential Applications

📌 Thermal Encapsulation & Gap Filling – Provides efficient heat transfer for high-power electronics.
📌 Potting Applications – Protects electronic components from environmental stress.
📌 EV Batteries & Power Modules – Ensures thermal stability in high-energy systems.
📌 LED & Lighting Modules – Reduces heat buildup in high-brightness LEDs.
📌 Automotive Electronics & Sensors – Provides thermal conductivity and flame resistance.