
FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
SilCool™ XE13-C1862PT is a one-component, heat-curable silicone adhesive specifically designed for thermally conductive applications. It provides excellent thermal conductivity (2.5 W/m·K), low viscosity, and high elongation compared to conventional products.
The material exhibits strong primerless adhesion to various substrates, is non-corrosive to metals, and cures rapidly when exposed to heat. These properties make it ideal for bonding and sealing applications in power electronics, rectifiers, regulators, and heat-generating components.
✅ Excellent Thermal Conductivity (2.5 W/m·K) – Ensures efficient heat dissipation.
✅ One-Component & Ready-to-Use – Simplifies application and handling.
✅ Primerless Adhesion – Bonds well to various metals and substrates.
✅ Fast Heat-Curing – Accelerates production cycles and efficiency.
✅ High Elongation (80%) – Provides flexibility and durability under thermal stress.
✅ Non-Corrosive to Metals – Ensures long-term reliability in electronic applications.
📌 Sealing & Bonding for Thermally Conductive Applications – Suitable for heat sinks, power modules, and PCB components.
📌 Electronics & Power Devices – Used in regulators, rectifiers, thyristors, and high-power electronics.
📌 LED & Optical Applications – Provides heat dissipation for LED assemblies.
📌 Battery & Automotive Applications – Ideal for thermal interface bonding in EV batteries and control units.
| Property | Unit | Value |
|---|---|---|
| Appearance | – | Gray, flowable paste |
| Viscosity (@ 23°C) | Pa·s | 50 |
| Curing Conditions | – | 1 hour at 150°C |
| Density (@ 23°C) | g/cm³ | 2.87 |
| Hardness (Type A) | – | 64 |
| Tensile Strength | MPa | 1.4 |
| Elongation | % | 80 |
| Adhesive Strength (Lap Shear, Al) | MPa | 0.9 |
| Linear Expansion Coefficient | 1/K | 1.3 × 10⁻⁴ |
| Thermal Conductivity | W/m·K | 2.5 |
| Thermal Resistance | mm²K/W | 25 |
| Glass Transition Temperature (Tg) | °C | -120 |
| Volume Resistivity | Ω·cm | 5.0 × 10¹⁴ |
| Dielectric Strength | kV/mm | 20 |
| Ionic Impurities (Na⁺, K⁺, Cl⁻) | ppm | <5 |
| Water Absorption | % | <0.6 |

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.

Partial Gasket & Seal Strategies Using Henkel Loctite SI 5910
Gasket sealing is a core part of many industrial assembly and maintenance operations — from automotive engine housings to HVAC covers and machinery flanges. When selecting a gasketing solution, you need something that forms reliably in place, resists movement and fluids, and simplifies application — which is where Henkel Loctite SI 5910 fits perfectly
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We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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