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Momentive SilCool™ XE13-C1862PT

  • Item No: SilCool™ XE13-C1862PT
  • Manufacturer: Momentive
  • Technologies: One-component silicone adhesive
  • Color: Gray, flowable paste
  • Cure Type: Heat-curing
  • Package Size: 333ml cartridge
  • Shelf Life: contact us for details

SilCool™ XE13-C1862PT is a one-component, heat-curable silicone adhesive specifically designed for thermally conductive applications. It provides excellent thermal conductivity (2.5 W/m·K), low viscosity, and high elongation compared to conventional products.

The material exhibits strong primerless adhesion to various substrates, is non-corrosive to metals, and cures rapidly when exposed to heat. These properties make it ideal for bonding and sealing applications in power electronics, rectifiers, regulators, and heat-generating components.


Key Features & Benefits

✅ Excellent Thermal Conductivity (2.5 W/m·K) – Ensures efficient heat dissipation.
✅ One-Component & Ready-to-Use – Simplifies application and handling.
✅ Primerless Adhesion – Bonds well to various metals and substrates.
✅ Fast Heat-Curing – Accelerates production cycles and efficiency.
✅ High Elongation (80%) – Provides flexibility and durability under thermal stress.
✅ Non-Corrosive to Metals – Ensures long-term reliability in electronic applications.

Potential Applications

📌 Sealing & Bonding for Thermally Conductive Applications – Suitable for heat sinks, power modules, and PCB components.
📌 Electronics & Power Devices – Used in regulators, rectifiers, thyristors, and high-power electronics.
📌 LED & Optical Applications – Provides heat dissipation for LED assemblies.
📌 Battery & Automotive Applications – Ideal for thermal interface bonding in EV batteries and control units.

Property Unit Value
Appearance Gray, flowable paste
Viscosity (@ 23°C) Pa·s 50
Curing Conditions 1 hour at 150°C
Density (@ 23°C) g/cm³ 2.87
Hardness (Type A) 64
Tensile Strength MPa 1.4
Elongation % 80
Adhesive Strength (Lap Shear, Al) MPa 0.9
Linear Expansion Coefficient 1/K 1.3 × 10⁻⁴
Thermal Conductivity W/m·K 2.5
Thermal Resistance mm²K/W 25
Glass Transition Temperature (Tg) °C -120
Volume Resistivity Ω·cm 5.0 × 10¹⁴
Dielectric Strength kV/mm 20
Ionic Impurities (Na⁺, K⁺, Cl⁻) ppm <5
Water Absorption % <0.6

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