
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
SilCool™ TIG830SP is a high-performance, silicone-based thermal grease designed to provide superior heat dissipation for electronic components. It features high thermal conductivity (4.1 W/m·K), low thermal resistance, and thin bond lines, making it an excellent candidate for screen printing and automated dispensing processes.
The grease maintains stable performance over a wide temperature range (-40°C to 150°C) with minimal weight loss and ionic impurities, ensuring long-term reliability in power electronics, LED modules, and semiconductor applications.
✅ High Thermal Conductivity (4.1 W/m·K) – Ensures efficient heat transfer and dissipation.
✅ Low Thermal Resistance (12 mm²·K/W @ 20µm BLT) – Reduces thermal interface resistance.
✅ Highly Workable & Easy Application – Suitable for screen printing and automated dispensing.
✅ Thin Bond Line Capability – Optimized for high-performance thermal interfaces.
✅ Wide Operating Temperature Range (-40°C to 150°C) – Stable in extreme environments.
✅ Minimal Weight Loss at High Temperatures – Prevents performance degradation over time.
✅ Low Ionic Impurities (<1 ppm Na⁺, K⁺, Cl⁻) – Prevents corrosion in sensitive electronics.
📌 Thermal Interface Material (TIM2) – Provides efficient heat transfer in high-performance electronics.
📌 Power Electronics & Semiconductor Packaging – Ensures effective cooling for high-power devices.
📌 LED & Optical Devices – Reduces heat buildup in LED modules and optical components.
📌 Automotive & Battery Systems – Used in EV batteries, control modules, and power inverters.
| Property | Unit | Value |
|---|---|---|
| Appearance | – | Gray paste |
| Thermal Conductivity | W/m·K | 4.1 |
| Viscosity (@ 23°C) | Pa·s | 300 |
| Penetration (@ 23°C) | – | 360 |
| Specific Gravity (@ 23°C) | – | 2.88 |
| Bleed (150°C, 24h) | wt% | 0.0 |
| Evaporation (150°C, 24h) | wt% | 0.3 |
| Thermal Resistance (BLT 20 µm) | mm²·K/W | 12 |
| Volatile Siloxane (D4-D10) | ppm | <100 |
| Ionic Impurities (Na⁺, K⁺, Cl⁻) | ppm | Na⁺: 0.5, K⁺: 0.0, Cl⁻: 0.1 |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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