TMP-FX7 Laminate is a high-performance thermal management material featuring a TPG (Thermal Pyrolytic Graphite) core* with metal or carbon fiber coatings. It provides exceptional thermal conductivity (>1500 W/m·K), making it an ideal solution for applications requiring efficient heat dissipation, fast thermal response, and low-profile, lightweight design.

This flexible and formable laminate is engineered for power electronics, RF & microwave packaging, high-power LEDs, and mobile devices, ensuring high durability and reliability in demanding thermal environments.

Key Features & Benefits

✅ Ultra-High Thermal Conductivity (>1500 W/m·K) – Outperforms traditional thermal materials.
✅ Fast Thermal Response – Ensures rapid heat dissipation for critical applications.
✅ Lightweight & Low Profile – Reduces component weight without compromising performance.
✅ Flexible & Formable – Suitable for custom shapes and compact designs.
✅ High Durability & Solderability – Ensures long-term reliability in harsh conditions.

otential Applications

📌 Power Electronics Packaging – Ensures efficient thermal management for high-power devices.
📌 RF & Microwave Packaging – Ideal for thermal shielding in high-frequency applications.
📌 High-Power LED & Lighting – Provides effective heat dissipation to prevent overheating.
📌 Mobile Devices & Wearable Electronics – Supports compact, lightweight designs with high heat performance.

Processing & Storage Guidelines

✅ Custom Coatings & Thickness Options Available – Vias and edge sealing can be customized upon request.
✅ Recommended Handling – Store in a clean, dry environment to maintain material integrity.
✅ Manufacturing Compatibility – Suitable for thermal spreading, heat sinking, and interface applications.