CTE-Matched TMP-EX Composite Heat Sink is a high-performance thermal management solution that integrates a Thermal Pyrolytic Graphite (TPG) core (>1500 W/m·K)* with a coefficient of thermal expansion (CTE)-matched enclosure. This ensures exceptional thermal conductivity and reliability, particularly for microelectronics and optoelectronic applications.

By achieving CTE matching with semiconductors, this heat sink minimizes thermal stress and improves long-term durability, making it an ideal solution for power electronics, RF & microwave packaging, high-power LEDs, and laser diodes.

Key Features & Benefits

✅ Ultra-High Thermal Conductivity (>1500 W/m·K) – Enhances heat dissipation efficiency.
✅ CTE Matching to Semiconductors – Reduces thermal expansion mismatches.
✅ Lightweight Design – Maintains high thermal performance with lower weight.
✅ High Structural Reliability – Resistant to thermal cycling, vibration, and shock.
✅ Nickel & Gold Plating Options – Enhances corrosion resistance and solderability.

Reliability & Performance Testing

The TMP-EX Composite Heat Sink has been rigorously tested under industry-standard conditions, including:

✅ Thermal Cycling (-65°C to +150°C, 1,000 cycles) – Maintains thermal performance.
✅ Vibration Resistance (20G/32hr per axial) – Ensures structural integrity under stress.
✅ Shock Resistance (500G/1ms per axial) – Withstands extreme impact forces.
✅ No Measurable Thermal Conductivity Change After Testing – Proven long-term reliability.