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LOCTITE STYCAST E 2517

  • Item Name: LOCTITE STYCAST E 2517
  • Manufacturer: Henkel Corporation
  • Product category: Epoxy encapsulant
  • Technologies: One-component epoxy with low coefficient of thermal expansion, low stress, low viscosity, and high temperature resistance
  • Applications: Designed for encapsulating bare chip protection in heavy duty industrial and automotive applications.
  • Color: Black liquid
  • Cure type: Heat cure
  • Package size: Contact to Avantek for details
  • Shelf life: 4 months

1. Product Overview

LOCTITE STYCAST E 2517 is a one-component epoxy encapsulant designed for bare chip protection in advanced electronic packages. It features low viscosity, low stress, low coefficient of thermal expansion (CTE), and high-temperature resistance up to 200°C. The product is heat-curing and is optimized for applications requiring high thermal stability.


2. Applications

  • Encapsulation for heavy-duty industrial and automotive applications.
  • Suitable for bare chip protection in advanced electronic packaging.

3. Typical Properties

Uncured Properties

Property Value
Appearance Black liquid
Viscosity (mPa·s @ 25°C) 22,500
Density (g/cm³) 1.725
Shelf Life (at -40 to 0°C) 120 days

Curing Performance

Cure Stage Temperature Duration
Pre-cure 120°C 1 hour
Full cure 150°C 1 hour
Post cure 200°C 2 hours
  • For stress-sensitive devices, a pre-cure at 120°C is recommended to minimize microcracks.
  • Post-cure improves thermal expansion properties and glass transition temperature (Tg).

Cured Properties

Property Value
Hardness (Shore D) 90
Coefficient of Thermal Expansion (ppm/°C) 19
Glass Transition Temperature (°C) 220
Young’s Modulus (N/mm²) 6,300
Water Absorption (24h @ 25°C, %) 0.08
Thermal Conductivity (W/m-K) 0.5

Electrical Properties

Property Value
Dielectric Constant (1 kHz) 4.1
Dissipation Factor (1 kHz) 0.007
Volume Resistivity (Ω·cm) 1.9 × 10¹⁵

4. Storage & Handling

  • Storage Temperature: -40°C to 0°C (optimal)
  • Shelf Life: 4 months at -40°C to 0°C
  • Stable for at least 1 day at 25°C
  • Preheat device to 70°C or heat material to 50°C to reduce viscosity.
  • Avoid heating above 60°C to prevent premature gelling.

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