Applications

LOCTITE PA 6732 Low-Pressure Molding

  • Item Name: LOCTITE® PA 6732
  • Manufacturer: Henkel
  • Product Category: Hot Melt Adhesive
  • Technologies: Polyamide, Low-Pressure Molding
  • Applications: Molding and encapsulation of fragile components, especially for medical devices
  • Color: Amber
  • Cure Type: Physical setting
  • Package Size: Contact Avantek for details.
  • Shelf Life: Contact Avantek for details.

1. Product Overview

LOCTITE® PA 6732 is a high-performance thermoplastic polyamide hot melt adhesive designed for low-pressure molding applications. It is particularly suitable for medical devices, offering excellent adhesion, moisture resistance, and environmental durability. The product is formulated for easy moldability and gentle encapsulation of fragile components.

  • Technology: Polyamide
  • Cure: Physical setting
  • Appearance: Amber
  • Viscosity: Medium
  • Molding Temperature: 210 – 240ºC (410 – 464ºF)
  • Operating Temperature Range: -40 to 140ºC (-40 to 284ºF)
  • ISO 10993 Certified: Biocompatibility tested for medical applications

2. Applications

  • Encapsulation of sensitive components
  • Molding for medical devices
  • Electrical & electronic component protection
  • Moisture & environmental-resistant coatings

Key Benefits:
Easy moldability
Strong adhesion to various substrates
Excellent moisture & environmental resistance
Simplified manufacturing process

3. Typical Properties

Before Curing (Unmixed Material)

Property Test Method Value
Specific Gravity @ 23ºC ISO 1183 0.98
Softening Point (°C) ASTM E28 187
Melting Viscosity (mPa·s) ASTM D3236
@ 200°C 5,500
@ 210°C 3,200
@ 220°C 2,500

After Curing (Cured Properties)

Property Test Method Value
Shore Hardness (A) ISO 868 90
Elongation (%) ASTM D638 400
Low Temperature Flexibility (°C) ASTM D3111 -40
Temperature Creep Resistance (°C) ELTM 1020 165
Glass Transition Temp (Tg) (°C) ASTM D3418 -45
Water Absorption (1 day, 23ºC, %) ISO 62 1.0
Tensile Strength at Break (N/mm²) ASTM D638 6 (870 psi)
Yield Strength (N/mm²) ASTM D638 5.5 (800 psi)
E-Modulus (N/mm²) ASTM D638 70 (10,150 psi)

Electrical Properties

Property Frequency (GHz) Value
Dielectric Constant / Dissipation Factor 5 GHz 2.53 / 0.028
10 GHz 2.64 / 0.023
20 GHz 2.6 / 0.018
30 GHz 2.59 / 0.016
40 GHz 2.59 / 0.015
50 GHz 2.57 / 0.014

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