LOCTITE ECCOBOND FP4451TD is a high-purity, heat-curing epoxy encapsulant designed as a damming material for bare chip encapsulation. It offers excellent chemical resistance and exceptional thermal stability.
| Property | Value |
|---|---|
| Uncured Properties | |
| Viscosity (Brookfield RVF, 25°C) | 300,000 mPa·s (cP) |
| Specific Gravity @ 25°C | 1.79 |
| Gel Time @ 121°C | 13 min |
| Pot Life @ 25°C | 10 days |
| Shelf Life @ -40°C | 274 days |
| Particle Size (median/max) | 20 µm / 200 µm |
| Curing Performance | |
| Cure Schedule | 30 min @ 125°C + 90 min @ 165°C |
| Cured Properties | |
| Coefficient of Thermal Expansion (ppm/°C) | 21 (below Tg) / 65 (above Tg) |
| Glass Transition Temperature (Tg) | 150°C |
| Extractable Ionic Content (Cl-, Na+, K+) | <10, <1, <1 |
| Electrical Properties | |
| Dielectric Constant @ 5 GHz | 3.52 |
| Dielectric Constant @ 50 GHz | 3.50 |
| Dissipation Factor @ 5 GHz | 0.0060 |
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