Industries

LOCTITE ECCOBOND FP4450HF

  • Item Name: LOCTITE ECCOBOND FP4450HF
  • Manufacturer: Henkel
  • Product Category: Encapsulant
  • Technologies: Epoxy, Heat Cure
  • Applications: IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules, BGA, Pin grid arrays
  • Color: Black
  • Cure Type: Heat cure
  • Package Size: Contact Avantek for details
  • Shelf Life: 9 months

1. Product Overview

  • Technology: Epoxy
  • Appearance: Black
  • Key Benefits:
    • High purity
    • Self-leveling
    • Excellent corrosion, chemical, and moisture resistance
    • High-temperature performance (-65 to 150°C)
    • High flow control
  • Filler Weight: 73%
  • Cure Type: Heat cure
  • Application: Encapsulation

2. Applications

  • IC memory cards
  • Chip carriers
  • Hybrid circuits
  • Chip-on-board
  • Multi-chip modules
  • BGA (Ball Grid Array)
  • Pin grid arrays

3. Typical Properties

Uncured Properties
Property Value
Gel Time @ 121°C 12 minutes
Shelf Life @ -40°C 274 days
Viscosity @ 25°C 32,000 cps
Specific Gravity 1.79
Particle Size (max) 25 µm
Pot Life @ 25°C 4 days
Curing Schedule
Cure Condition Duration
125°C 30 minutes
165°C 90 minutes
Alternative Cure:
110°C 1 hour
165°C 3 hours
Cured Properties
Property Value
Glass Transition Temperature (Tg) 164°C
Coefficient of Thermal Expansion (ppm/°C) Below Tg: 21, Above Tg: 72
Thermal Conductivity @ 100°C 0.62 W/(m-K)
Alpha Particle Emissions 0.001 cts/cm²/hr
Extractable Ionic Content Cl⁻: 2 ppm, Na⁺: 1 ppm, K⁺: 1 ppm
Electrical Properties
Frequency Dielectric Constant Dissipation Factor
5 GHz 3.56 0.0029
10 GHz 3.55 0.0062
20 GHz 3.52 0.0069
30 GHz 3.51 0.0058
40 GHz 3.52 0.0058
50 GHz 3.49 0.017

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