Applications

LOCTITE ABLESTIK QMI519

  • Item Name: LOCTITE ABLESTIK QMI519
  • Manufacturer: Henkel
  • Product Category: Electrically and Thermally Conductive Adhesive
  • Technologies: BMI Acrylate, Silver-Filled Conductive Adhesive
  • Applications: Die Attach for SOIC, SOP, QFP, and QFN Packages, Bonding ICs to Metal Leadframes
  • Color: Silver
  • Cure Type: Heat Cure
  • Package Size: Contact Avantek for details.
  • Shelf Life: 1 year (12 months) at -40°C

1. Product Overview

LOCTITE ABLESTIK QMI519 is a silver-filled, electrically & thermally conductive adhesive designed for die attach applications. It features:

  • One-component formulation
  • High thermal stability and resistance to delamination
  • Void-free bondline with hydrophobic properties
  • Fast heat cure process
  • Compatible with Copper, Silver, Palladium, Alloy 42, and ceramic surfaces
  • Used in SOIC, SOP, QFP, and QFN packages

2. Applications

  • Bonding integrated circuits and components to metal leadframes
  • Optimized for high-volume production with in-line curing
  • Enhanced coplanarity when cured on the die bonder

3. Typical Properties

Properties Values
Uncured Properties
Viscosity @ 25°C 9,000 mPa∙s (cP)
Thixotropic Index 4.2
Specific Gravity 3.8
Pot Life @ 25°C 48 hours
Shelf Life @ -40°C 1 year
Curing Performance
SkipCure Process ≥10 sec @ 200°C
Alternative Cure 1 15 min @ 185°C
Alternative Cure 2 15 min @ 200-220°C
Cured Properties
Coefficient of Thermal Expansion (CTE) α1 40 ppm/°C
CTE α2 140 ppm/°C
Glass Transition Temperature (Tg) 75°C
Young’s Modulus 5,300 N/mm² (769,000 psi)
Thermal Conductivity 3.8 W/m-K
Electrical Properties
Volume Resistivity 0.0001 ohm-cm
Die Shear Strength
Ag-plated Cu (300×300 mil, 1 mil bondline) @ 25°C 10 N/mm² (1,450 psi)

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