Applications

LOCTITE ABLESTIK ABP 8037TI – Conductive Adhesive

Item Name: LOCTITE ABLESTIK ABP 8037TI
Manufacturer: Henkel
Technologies: Acrylate-based, silver-filled conductive adhesive
Color: Silver paste
Cure Type: Heat cure
Package Size: Contact to Avantek for details.
Shelf Life: 12 months

1. Product Overview

LOCTITE ABLESTIK ABP 8037TI is a silver-filled conductive adhesive designed for die attach applications. It offers excellent electrical and thermal conductivity, strong adhesion, and stability at high temperatures.

2. Applications

  • Die attach for integrated circuits and components
  • Suitable for use with metal leadframes and advanced substrates
  • Compatible with a wide variety of metals and ceramic surfaces, including silver-plated copper and pre-plated leadframes (NiPdAu)

3. Typical Properties

Property Value
Uncured Properties
Appearance Silver paste
Filler Type Silver
Filler Weight (%) 82%
Viscosity (Brookfield, 25°C, Spindle 51, 5 rpm) 11,000 mPa·s (cP)
Thixotropic Index (0.5/5 rpm) 5.8
Work Life @ 25°C 24 hours
Shelf Life @ -40°C 365 days
Curing Performance
Recommended Cure 30 min ramp to 175°C, hold 30 min @ 175°C
Alternate Cure 30 min ramp to 150°C, hold 30 min @ 150°C
Cured Properties
Glass Transition Temperature (Tg) 46°C
Thermal Conductivity 4.1 W/(m·K)
Coefficient of Thermal Expansion (CTE) Below Tg 62 ppm/°C
CTE Above Tg 94 ppm/°C
Mechanical Properties
Young’s Modulus (E) @ 25°C 5,900 N/mm² (855,722 psi)
Young’s Modulus (E) @ 150°C 2,900 N/mm² (420,609 psi)
Electrical Properties
Volume Resistivity 6.00 × 10⁻⁵ ohm·cm
Shear Strength
Die Shear Strength @ 25°C (Ag/Cu LF, 120×120 mil) 17.6 Kg
Die Shear Strength @ 270°C (Ag/Cu LF, 120×120 mil) 7.4 Kg

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