Applications

LOCTITE ABLESTIK 8600

  • Item Name: LOCTITE ABLESTIK 8600
  • Manufacturer: Henkel
  • Product Category: Electrically & Thermally Conductive Die Attach Adhesive
  • Technologies: Acrylate-based, Snap Cure & Heat Cure
  • Applications: Die attach for small SO and QFN type packages
  • Color: Silver
  • Cure Type: Snap cure and heat cure
  • Package Size: Contact Avantek for details
  • Shelf Life: 1 year (-40°C storage)

1. Product Overview

  • Technology: Acrylate
  • Appearance: Silver
  • Cure Type: Snap Cure & Heat Cure
  • Key Benefits:
    • Electrically & thermally conductive
    • Low bleed
    • Improved JEDEC performance
    • Compatible with Ag, PPF, and Cu
  • Application: Die attach
  • Filler Type: Silver
  • Typical Package Applications: Small SO & QFN packages
  • Limitations: Not recommended for high-density leadframes (>500 pads)

2. Applications

  • Used in high-reliability die attach applications
  • Suitable for small SO and QFN packages
  • Provides medium thermal and electrical conductivity

3. Typical Properties

Property Value
Uncured Properties
Thixotropic Index (0.5/5 rpm) 4.7
Viscosity @ 25°C (5 rpm) 7,500 mPa·s (cP)
Work Life @ 25°C 24 hours
Shelf Life @ -40°C 1 year
Curing Performance
Snap Cure Schedule (7 Zones) 150°C → 220°C (60s)
Oven Cure 175°C (30 min ramp + 15 min hold)
Cured Properties
CTE Below Tg 46 ppm/°C
CTE Above Tg 160 ppm/°C
Glass Transition Temperature (Tg) 187°C (Tan Δ) / 108°C (TMA)
Thermal Conductivity >4 W/(m·K)
Tensile Modulus @ 25°C 9,600 N/mm² (1,395,000 psi)
Weight Loss on Cure 1.5%
Extractable Ionic Content (Cl-, Na+, K+) <10 ppm each
Weight Loss @ 300°C 0.32%
Volume Resistivity 0.00008 Ω·cm
Performance Properties
Die Shear Strength @ 270°C 16.3 – 16.8 kg-f/die
Die Shear Strength @ 25°C 11 kg-f/die
Chip Warpage (Post Mold Bake @ 175°C) 15.3 µm

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