Applications

Liquid-Dispensed Silicone Thermal Pad/ GapFiller SilCool TIA265GF (XE14-D0034)

  • Product code: TIA265GF (XE14-D0034)
  • Manufacturer: Momentive
  • Package size: contact us for details
  • Shelf Life: contact us for details

SilCool TIA265GF (XE14-D0034) is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. TIA26GF can be used as liquid dispensed alternative to pre-fabricated Thermal Pads, for a broad array of thermal designs in electronic applications.

KEY FEATURES
• High thermal conductivity
• Fast, low temperature cure
• Convenient 1:1 mix ratio by weight
• Retains softness after cure to contribute to stress relief during thermal cycling
• Good slump resistance (stays in place)
• Repairable
• Typical Operating Temp Range -40° to 150°C

APPLICATIONS 

Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.

Đặc điểm TIA 265GF
XE14-D0034 (A)
TIA 265GF
XE14-D0034 (B)
Màu (Thành phần A & Thành phần B) hồng hồng nhạt
Độ nhớt*1 Pa⋅s 230 225
Tỷ lệ trộn theo trọng lượng 1:1 1:1
Độ nhớt sau khi trộn Pa⋅s 184 184
Chỉ số lưu biến 2.6 2.6
Thời gian thao tác @ 23°C (giờ) 1 1
Điều kiện khô
@ 70°C
@ 23°C
(hours)
1
24
1
24

Everwide FX244-1: High Performance for Precision Molding

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

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