Package Sizes: Contact us for details
Shelf Life: 12 months
Insulcast LN 1-05 is a low-exotherm, non-cracking epoxy compound designed specifically for large potting and encapsulation applications. It maintains excellent electrical insulation properties across a wide temperature range and is formulated with advanced polymer and filler technology to minimize shrinkage and internal stresses. This makes it an ideal solution for thick-section castings and high-volume electronic potting applications.
✅ Low Exotherm Formula: Prevents excessive heat build-up, reducing internal stresses.
✅ Non-Cracking: Ensures structural integrity, even in large castings.
✅ Excellent Electrical Properties: Provides high dielectric strength and volume resistivity.
✅ Advanced Polymer and Filler Technology: Reduces shrinkage and enhances durability.
✅ Good Thermal Conductivity: Ensures effective heat dissipation in electronic applications.
🔹 Large Potting Applications: Ideal for encapsulating sizable electronic components.
🔹 Encapsulation Processes: Protects sensitive electronics from environmental damage.
🔹 Transformer & Coil Potting: Provides insulation and structural stability.
🔹 Industrial Electronics: Used in control modules, power supplies, and high-voltage equipment.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Black | Neutral | – | Visual |
| Viscosity (cP) | 120,000 | 10 | 5,000 | ASTM D2393 |
| Specific Gravity | 1.62 | 0.94 | – | – |
| Mix Ratio (by Weight) | 7.2:1 | – | – | – |
| Mix Ratio (by Volume) | 4.15:1 | – | – | – |
| Pot Life (100g mass) | – | – | 8-10 hours | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore D) | 85 | ASTM D2240 |
| Coefficient of Thermal Expansion (°C⁻¹) | 32 × 10⁻⁶ | – |
| Thermal Conductivity (BTU-in/(ft²·hr·°F)) | 4.5 | – |
| Thermal Conductivity (W/m·K) | 0.648 | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 400 | – |
| Volume Resistivity (ohm-cm) | 6 × 10¹⁵ | – |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 36 hours at 25°C (77°F) |
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
Office address: The Verosa Park, 39 street 10, Quarter 2, Long truong Ward, Ho Chi Minh City, Viet Nam
Website: avantek.vn
Email 1: info@avantek.vn
Email 2: long.pham@avantek.vn
Tel: (+84) 944 415 762
Copyright © AVANTEK VN CO., LTD
Leave your information or contact via Hotline, our Customer Support Technical team will contact you immediately!
