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Indium 10.1 – Indium PASTEOT-82711 Solder Paste, No Clean, Lead Free, T4, 88.5%, SAC305, 500g Jar

  • Alternate Product Number: Indium10.1
  • Mfr Part #: PASTEOT-82711
  • Brand: Indium
  • Alloy: SAC305
  • Lead Type: Lead Free
  • Composition: 96.5% Tin, 3% Silver, 0.5% Copper
  • Type: Solder Paste
  • Package: 500g Jar
  • Shelf Life: 365 days

1. Product Overview

Indium PASTEOT-82711 is a no-clean, lead-free solder paste designed for high-performance PCB assembly. It features low voiding, high oxidation resistance, and superior wetting properties, making it ideal for miniaturized components, QFNs, BGAs, and CSPs. Its oxidation-inhibiting formulation helps eliminate head-in-pillow (HIP) and graping defects, ensuring reliable solder joints even under extended reflow profiles.


2. Applications

  • PCB assembly for high-reliability electronics
  • Fine-pitch soldering for BGA, CSP, QFN, and RF shielding
  • High-density PCB designs requiring excellent print definition
  • Reflow under both air and nitrogen atmospheres
  • Applications with difficult-to-solder or oxidized metallizations

3. Typical Properties

Property Specification
Brand Indium
Alloy SAC305 (96.5% Sn, 3% Ag, 0.5% Cu)
Lead-Free Yes
Flux Type No-Clean
Halogen Content Halogen-Containing
Powder Mesh Size T4
Metal Content 88.5%
Physical State Paste
Package Type 500g Jar
Reflow Atmosphere Air or Nitrogen
Shelf Life 365 days
Series 10.1 Series

Everwide FX244-1: High Performance for Precision Molding

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

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