Technology: Epoxy-based structural adhesive
Product code: H.B. Fuller Resiweld FE7004
Manufacturer: H.B. Fuller
Package Size: Available in various sizes (kg or pail)
Shelf life: To know more, contact Avantek
H.B. Fuller Resiweld FE7004 is a two-component epoxy adhesive offering high strength, excellent chemical resistance, and versatile curing options. It can be mixed in 1:1 (flexible) or 2:1 (rigid) volume ratios, allowing users to adjust mechanical properties to suit various applications. This adhesive provides strong bonding to metals, ceramics, wood, plastics, and composites, making it ideal for demanding industrial and structural applications.
3. Typical Properties (Unmixed Components)
| Property | Part A | Part B | Mixed | Test Method/Condition |
|---|---|---|---|---|
| Appearance/Color | Amber | Amber | Amber | – |
| Specific Gravity | 1.15 | 0.959 | 1.09 | – |
| Viscosity (cPs, 25°C) | 3500 | 5000 | 4000 | – |
| Weight Mix Ratio | – | – | 100:42 (rigid) | – |
| Volume Mix Ratio | – | – | 100:50 (rigid) / 100:100 (flexible) | – |
| Property | Rigid Ratio | Flexible Ratio | Test Method/Condition |
|---|---|---|---|
| Hardness | 78 Shore D | 73 Shore D | ASTM D2240 |
| Aluminum Bond Strength | 17.2 MPa (2500 psi) | 35.9 MPa (5200 psi) | ASTM D1002, 25°C, 50% RH |
| Dielectric Constant | 2.88 | – | ASTM D150, 23°C, 100Hz |
| Operating Temperature Range | -73°C to 95°C (-100°F to 200°F) | – | – |
| Gel Time | 50 – 70 minutes | – | 25°C |
| Full Cure (Room Temp) | 10 to 14 days | – | 23°C |
| Full Cure (Heat Cure) | 3 to 4 hours | – | 66°C |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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