H.B. Fuller EA6107 is a high-performance, dual-cure adhesive designed for bonding flexible printed circuit boards (FPCBs) and other electronic applications. It features both UV and moisture curing, enabling strong adhesion in shadowed areas where UV light cannot reach. The adhesive offers rapid initial curing under UV light, followed by continued strength development through moisture exposure. Its high viscosity and controlled flow characteristics make it suitable for precision bonding without excessive spreading.
| Property | Value |
|---|---|
| Appearance | Blue liquid |
| Component | Acrylate-based |
| Viscosity @ 25°C | 12,800 cP (Spindle 52, 5 rpm) |
| Thixotropic Index | 5.1 |
| Density | 1.05 g/cm³ |
| Curing Method | UV + Moisture |
| UV Cure | 100 mW/cm² @ 365nm for 30s |
| Moisture Cure | Occurs at ambient humidity |
| Tack-Free Time | < 15 sec (UV cure) |
| Depth of Cure | 8 mm @ 30s UV exposure |
| Shore D Hardness | 20 (initial), increases to 70 after 7 days moisture cure |
| Storage Temperature | 2°C to 8°C |
| Shelf Life | 6 months (unopened) |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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