Products

H.B. Fuller 1521 Black Silicone potting junction boxes in PV modules

  • Technology: Silicone, two-component, room-temperature cure
  • Brand Name: H.B. Fuller 1521 Silicone Adhesive
  • Manufacturer: H.B. Fuller
  • Package Size: 14kg
  • Shelf Life: 6 months

1. Product Overview

H.B. Fuller 1521 is a two-component silicone adhesive designed for potting applications. It cures at room temperature and offers excellent sealing, bonding, and electrical insulation properties. The adhesive is easy to handle with a 6:1 mixing ratio and is suitable for automated dispensing.

Key Features & Benefits:

  • Fast cure at room temperature with excellent deep-section curing.
  • Easy handling due to a 6:1 mixing ratio.
  • Strong adhesion to various substrates.
  • Compatible with automated dispensing equipment.
  • Excellent electrical insulation and thermal resistance.
  • High resistance to hot and humid conditions.

Storage & Shelf Life:

  • Store in a cool, dry place in unopened containers at room temperature.
  • Shelf life: 6 months from the date of manufacture.

2. Applications

H.B. Fuller 1521 is recommended for potting electronic components, particularly for junction boxes in PV modules. It provides strong adhesion, electrical insulation, and environmental resistance for long-term durability.

Typical Uses:

  • Potting and encapsulation of sensitive electronic components.
  • Sealing and bonding in solar module junction boxes.
  • Applications requiring high thermal and electrical performance.

 


3. Typical Properties

Property Part A (Resin) Part B (Activator) Mixed Test Method
Appearance Black, viscous liquid
Viscosity 13,000 mPa·s 25 mPa·s 3,000 mPa·s GB/T 2794
Density 1.40 g/cm³ GB/T 13354
Mix Ratio (Volumetric) 4:1
Mix Ratio (Weight) 6:1
Flash Point > 93°C GB/T 5208
Working Time 8 minutes
Gel Time 60 minutes

Cured Properties

Property Value Test Method
Hardness 40 Shore A GB/T 531
Tensile Strength 1.2 MPa GB/T 528
Elongation at Break 110% GB/T 528
Thermal Service Range -50°C to 150°C
Thermal Conductivity 0.30 W/m·K DIN EN 821
Volume Resistivity 1.0 × 10¹⁵ Ω·cm GB/T 1692
Breakdown Strength 23 kV/mm GB/T 1695
Damp-Heat Aging (85°C, 85% RH for 1000h) Volume Resistivity: 1.0 × 10¹⁵ Ω·cm GB/T 1692

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