FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Everwide
Product Number: JD173-2
Technology: Two-Component Thermally Conductive Epoxy
Color: Gray (Part A), White (Part B)
Cure Type: Room Temperature or Heat Curing
Package Size: Contact us for details
Shelf Life: 6 months
Everwide JD173-2 is a two-component thermally conductive epoxy designed for electronics and thermal modules. It is an inorganic powder-filled epoxy that exhibits excellent thermal conductivity, electrical insulation, low shrinkage, and low water absorption. This adhesive also demonstrates superior adhesion strength to metal substrates, making it ideal for thermal management applications.
| Property | JD173-2A (Part A) | JD173-2B (Part B) |
|---|---|---|
| Appearance | Liquid | Liquid |
| Color | Gray | White |
| Viscosity (25°C, S14 2rpm, cps) | 170,000–280,000 | 230,000–400,000 |
| Viscosity (25°C, S14 20rpm, cps) | 49,000–60,000 | – |
| Mixed Viscosity (25°C, S14 2rpm, cps) | 170,000–100,000 | |
| Thixotropic Index | 3–4.5 | – |
| Specific Gravity | 2.37 | 2.33 |
| Property | Value |
|---|---|
| Mix Ratio (A:B) by Weight | 2:1 |
| Pot Life (25°C) | 1 hr |
| Through Cure Time (25°C) | 7 days |
| Through Cure Time (80°C) | 60 min |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (MDSC) | 44°C |
| CTE (<Tg), µm/m/°C | 29 |
| CTE (>Tg), µm/m/°C | 100 |
| Specific Heat (0°C) | 0.579 J/g°C |
| Specific Heat (25°C) | 0.624 J/g°C |
| Specific Heat (50°C) | 0.775 J/g°C |
| Specific Heat (75°C) | 0.831 J/g°C |
| Specific Heat (100°C) | 0.881 J/g°C |
| Durometer Hardness (Shore D) | 88 |
| Specific Gravity | 2.42 |
| Shear Strength (Al vs. Al) | 259 kgf/cm² |
| Water Absorption (25°C, 24 hr) | 0.22% |
| Water Absorption (80°C, 24 hr) | 0.79% |
| Water Absorption (97°C, 1.5 hr) | 0.53% |
| Degradation Temperature (TGA, 10°C/min) | 314°C |
| Weight Loss Ratio @ 100°C | 0% |
| Weight Loss Ratio @ 150°C | 0.21% |
| Weight Loss Ratio @ 200°C | 0.76% |
| Weight Loss Ratio @ 250°C | 2.76% |
| Weight Loss Ratio @ 300°C | 4.24% |
| Weight Loss Ratio @ 350°C | 8.74% |
| Thermal Conductivity | 2 W/mK |
| Thermal Resistance | 0.002 m²K/W |
| Volume Resistivity | 3.84 × 10¹³ ohm-cm |
| Surface Resistivity | 5.61 × 10¹² ohm |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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