FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Everwide
Product Number: JC258-1
Technology: High-Performance Epoxy Adhesive
Color: Black (Part A), Yellow (Part B)
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 1 year
Everwide JC258-1 is a two-component, medium-viscosity, toughened epoxy adhesive designed for high-performance bonding applications. The cured resin exhibits exceptional peel and shear strength, with outstanding crack and fatigue resistance for vibration-prone environments. This adhesive is compatible with plastics, metals, glass, and ceramics, offering excellent durability and passing multiple environmental test standards.
| Property | JC258-1A (Part A) | JC258-1B (Part B) |
|---|---|---|
| Appearance | Liquid | Liquid |
| Color | Black | Yellow |
| Viscosity (25°C, S14 20rpm, cps) | 22,000–34,000 | 13,000–22,000 |
| Viscosity (25°C, S14 2rpm, cps) | 60,000–100,000 | 17,000–30,000 |
| Thixotropic Index | ≥2.0 | ≥1.2 |
| Mixing Viscosity (25°C, S14 20rpm, cps) | 27,000–42,000 | |
| Thixotropic Index (Mixed) | ≥2.5 |
| Property | Value |
|---|---|
| Mix Ratio (A:B) by Weight | 2:1 |
| Pot Life (25°C) | 20–30 min |
| Surface Dry Time (25°C) | 4 hr |
| Through Cure Time (25°C) | 7 days |
| Through Cure Time (80°C) | 1 hr |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (DSC) | 60°C |
| Glass Transition Temperature (Tg) (MDSC) | 62°C |
| Glass Transition Temperature (Tg) (TMA) | 66°C |
| CTE (35–55°C), µm/m/°C | 96 |
| CTE (90–130°C), µm/m/°C | 188 |
| Durometer Hardness (Shore D) | 76 |
| Specific Gravity | 1.07 |
| Water Absorption (25°C, 24 hr) | 0.24% |
| Water Absorption (80°C, 24 hr) | 2.19% |
| Water Absorption (97°C, 1.5 hr) | 0.78% |
| Shear Strength (Al vs. Al) | 454 kgf/cm² |
| Degradation Temperature (TGA, 10°C/min) | 288°C |
| Weight Loss Ratio @ 100°C | 0.01% |
| Weight Loss Ratio @ 150°C | 0.63% |
| Weight Loss Ratio @ 200°C | 1.19% |
| Weight Loss Ratio @ 250°C | 2.52% |
| Weight Loss Ratio @ 300°C | 6.06% |
| Weight Loss Ratio @ 350°C | 11.19% |
| Thermal Conductivity | 0.3 W/mK |
| Thermal Resistance | 0.01 m²K/W |
| Volume Resistivity | 5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 5 × 10¹⁴ ohm |
| Dielectric Constant (100Hz) | 4.1 |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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