FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Everwide
Product Number: JB925-30
Technology: Two-Component Epoxy Adhesive
Color: Milky (Part A), Yellow (Part B)
Cure Type: Room Temperature or Heat Curing
Package Size: Contact us for details
Shelf Life: 1 year
Everwide JB925-30 is a medium-viscosity, two-component epoxy adhesive designed for bonding plastics, metals, and construction materials such as concrete and limestone. The cured product exhibits a high-gloss surface finish and offers excellent crack and fatigue resistance, making it ideal for vibration-prone applications. This adhesive also provides high adhesion strength, resistance to grease, chemicals, and solvents, ensuring long-term performance in demanding environments.
| Property | JB925-30A (Part A) | JB925-30B (Part B) |
|---|---|---|
| Appearance | Liquid | Liquid |
| Color | Milky | Yellow |
| Viscosity (25°C, S14 10rpm, cps) | 20,000–30,000 | 21,000–33,000 |
| Property | Value |
|---|---|
| Mix Ratio (A:B) by Weight | 2:1 |
| Pot Life (25°C) | 20 min |
| Tack-Free Time (25°C) | 2–3 hr |
| Through Cure Time (25°C) | 5–7 days |
| Through Cure Time (80°C) | 60 min |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 73°C |
| CTE (60–70°C), µm/m/°C | 115 |
| CTE (175–200°C), µm/m/°C | 204 |
| Volume Shrinkage | 3% |
| Linear Shrinkage | 1.73% |
| Durometer Hardness (Shore D) | 84 |
| Specific Gravity | 1.17 |
| Water Absorption (25°C, 24 hr) | 0.42% |
| Water Absorption (80°C, 24 hr) | 6.03% |
| Water Absorption (97°C, 1.5 hr) | 2.86% |
| Shear Strength (Al vs. Al) | 297 kgf/cm² |
| Shear Strength (Al vs. PC) | 123 kgf/cm² |
| Shear Strength (Al vs. PC(ABS)) | 156 kgf/cm² |
| Shear Strength (Al vs. Cu) | 198 kgf/cm² |
| Shear Strength (SUS vs. Cu) | 187 kgf/cm² |
| Shear Strength (SUS vs. PC(ABS)) | 104 kgf/cm² |
| Trust Strength (FR4 vs. Al) | 96 kgf/cm² |
| Trust Strength (FR4 vs. PC) | 67 kgf/cm² |
| Degradation Temperature (TGA, 10°C/min) | 312°C |
| Weight Loss Ratio @ 100°C | < 0.5% |
| Weight Loss Ratio @ 150°C | < 0.5% |
| Weight Loss Ratio @ 200°C | 0.35% |
| Weight Loss Ratio @ 250°C | 1.26% |
| Weight Loss Ratio @ 300°C | 3.79% |
| Weight Loss Ratio @ 350°C | 19.49% |
| Volume Resistivity | 5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 5 × 10¹⁴ ohm |
| Dielectric Constant (100Hz) | 4.1 |
| Dielectric Strength | 21 KV/mm |
| Temperature Resistance Range | -40 to 120°C |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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