FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Everwide
Product Number: JB267-12
Technology: Epoxy for Optical and Electronic Devices
Color: Light Yellow (Part A), Yellow (Part B)
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 1 year
Everwide JB267-12 is a two-component epoxy resin developed for fiber optics, semiconductor, electronic, and medical device applications. It provides excellent bonding performance on a variety of substrates and offers long working time after mixing. This epoxy exhibits low outgassing, high-temperature resistance, and strong chemical resistance, making it suitable for precision applications.
| Property | JB267-12A (Part A) | JB267-12B (Part B) |
|---|---|---|
| Appearance | Liquid | Liquid |
| Color | Light Yellow | Yellow |
| Viscosity (25°C, S14 100rpm, cps) | 2,500–4,600 | 1,000–1,700 |
| Mixing Viscosity (25°C, S14 100rpm, cps) | 2,000–3,000 |
| Property | Value |
|---|---|
| Mix Ratio (A:B) by Weight | 10:1 |
| Pot Life (25°C) | 3 hr |
| Cure Time (80°C) | 40 min |
| Cure Time (100°C) | 10 min |
| Cure Time (120°C) | 5 min |
| Cure Time (150°C) | 2 min |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (MDSC) | 113°C |
| CTE (<Tg), µm/m/°C | 58 |
| CTE (>Tg), µm/m/°C | 200 |
| Specific Heat (25°C) | 0.9 J/g°C |
| Specific Heat (50°C) | 1.1 J/g°C |
| Specific Heat (75°C) | 1.2 J/g°C |
| Specific Heat (100°C) | 1.4 J/g°C |
| Durometer Hardness (Shore D) | 86 |
| Specific Gravity | 1.22 |
| Water Absorption (25°C, 24 hr) | 0.08% |
| Water Absorption (80°C, 24 hr) | 4.32% |
| Water Absorption (97°C, 1.5 hr) | 1.54% |
| Shear Strength (Al vs. Al) | 267 kgf/cm² |
| Shear Strength (Al vs. Al, 85°C, 85%RH, 1000hr) | 335 kgf/cm² |
| Shear Strength (Glass vs. Glass) | 154 kgf/cm² |
| Degradation Temperature (TGA, 10°C/min) | 372°C |
| Weight Loss Ratio @ 100°C | 0% |
| Weight Loss Ratio @ 150°C | 1.2% |
| Weight Loss Ratio @ 200°C | 1.2% |
| Weight Loss Ratio @ 250°C | 1.5% |
| Weight Loss Ratio @ 300°C | 2.2% |
| Weight Loss Ratio @ 350°C | 3.9% |
| Thermal Conductivity | 0.3 W/mK |
| Thermal Resistance | 0.01 m²K/W |
| Volume Resistivity | 4.5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 4.5 × 10¹⁴ ohm |
| Dielectric Constant (1kHz) | 3.2 |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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