Applications

Everwide JA293-49 Epoxy for Electronic Devices Potting

Brand: Everwide
Product Number: JA293-49
Technology: Epoxy Adhesive
Color: Black (Part A), Colorless (Part B)
Cure Type: Room Temperature or Heat Curing
Package Size: Contact us for details
Shelf Life: 1 year

Product Description

Everwide JA293-49 is a two-component epoxy adhesive developed for electronic device potting. It offers excellent fluidity, making it easy to apply and process. The cured product provides a high-gloss surface finish and strong chemical resistance. With an extended pot life, this epoxy is ideal for industrial applications that require long working times. It also meets stringent environmental standards and provides high durability for demanding conditions.

Key Features

  • Low viscosity with excellent fluidity for easy potting
  • Mixed product easily defoams, ensuring a smooth application
  • Minimal exotherm, even in large volumes
  • Complies with 2011/65/EU RoHS regulations
  • Certified to UL94V-0 flame retardant standards

Recommended Applications

  • Potting of electronic devices
  • Industrial applications requiring high-performance epoxy encapsulation
  • Situations where extended pot life and smooth curing are required

Technical Data

Typical Uncured Properties
Property JA293-49A (Part A) JA293-49B (Part B)
Appearance Liquid Liquid
Color Black Colorless
Viscosity (25°C, cps) 70,000–140,000 ≤100
Mixing Viscosity (25°C, cps, S14 100rpm) 3,000–5,000
Thixotropic Index ≥2.5
Specific Gravity 2.08 0.98
Curing Properties
Property Value
Mix Ratio (A:B) by Weight 100:8
Pot Life (25°C) 6 hours
Through Cure Time (25°C) 5–7 days
Through Cure Time (80°C) 2 hours
Typical Cured Properties
Property Value
Glass Transition Temperature (Tg) 41°C
CTE (<Tg), μm/m/°C 83
CTE (>Tg), μm/m/°C 181
Specific Heat (0°C) 0.33 J/g°C
Specific Heat (25°C) 0.47 J/g°C
Specific Heat (50°C) 0.70 J/g°C
Specific Heat (75°C) 0.74 J/g°C
Specific Heat (100°C) 0.77 J/g°C
Durometer Hardness (Shore D) 84
Water Absorption (25°C, 24 hr) 1.45%
Water Absorption (80°C, 24 hr) 1.16%
Water Absorption (97°C, 1.5 hr) 0.69%
Degradation Temperature (TGA, 10°C/min) 340°C
Thermal Conductivity 0.8 W/mK
Volume Resistivity 4.5 × 10¹⁵ ohm-cm
Surface Resistivity 4.5 × 10¹⁴ ohm
Dielectric Constant (100Hz) 4.1

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FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

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