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DOWSIL™ TC-5622 Thermally Conductive Compound – Adhesive/Sealant – Thermal Management

-Item Name: DOWSIL™ TC-5622 Thermally Conductive Compound
-Manufacturer: Dow
-Technologies: Filled polydimethylsiloxane
-Color: Gray
-Cure Type: Non-curing
-Package Size: Contact to Avantek for details.
-Shelf Life: Contact to Avantek for details.

1. Product Overview

DOWSIL™ TC-5622 is a gray, flowable, non-curing thermally conductive compound designed for efficient heat dissipation in electronic modules. It is solventless, easy to apply, and provides low thermal resistance with high thermal conductivity. The compound enhances the cooling of electronic components by acting as a thermal interface material between heat-generating devices and heat sinks or chassis.

2. Applications

  • Cooling of computer MPUs and power modules
  • PCB system assemblies
  • Heat sink and chassis interface
  • Consumer electronic devices requiring thermal management

3. Typical Properties

Before Mixing (Uncured Properties)

Property Unit Result
Color Gray
Viscosity cP / Pa-sec 95,000 / 95
Specific Gravity 2.5
Thermal Conductivity W/m·K 4.3
Thermal Resistance (at 25 N/cm²) °C·cm²/W 0.06
Bond Line Thickness inch / mm 0.0008 / 0.02

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