DOWSIL™ TC-5026 is a gray, flowable, non-curing thermally conductive compound designed for efficient heat dissipation in electronics. It offers:
DOWSIL™ TC-5026 is used for thermal management in high-performance electronic assemblies such as:
| Property | Unit | Result |
|---|---|---|
| One or Two-part | – | One |
| Color | – | Gray |
| Viscosity | cP / mPa·s / Pa·s | 100,000 / 100,000 / 100 |
| Specific Gravity (Uncured) | – | 3.5 |
| Non-Volatile Content (NVC) | % | 99.95 |
| Thermal Conductivity | W/m·K | 2.9 |
| BTU/hr-ft-°F | 1.7 | |
| Thermal Resistance at 40 psi | °C·cm²/W | 0.03 |
| Bond Line Thickness (BLT) at 40 psi | mm / inch / mils | 0.007 / 0.0003 / 0.3 |
| Electrical Properties | ||
| Dielectric Strength | volts/mil / kV/mm | 227 / 8.9 |
| Volume Resistivity | ohm·cm | 5.9E+11 |
| Dielectric Constant at 1kHz | – | 7.4 |
| Dissipation Factor at 1kHz | – | 0.0003 |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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