Applications

DOWSIL™ 3-6752 Thermally Conductive Adhesive

  • Technology: Thermally Conductive Silicone Adhesive
  • Brand Name: DOWSIL™ 3-6752 Thermally Conductive Adhesive
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Avantek for details.
  • Shelf Life: Contact Avantek for details.

1. Product Overview

DOWSIL™ 3-6752 is a one-part, heat-cure, thermally conductive adhesive with high thermal conductivity, excellent flame resistance (UL 94 V-0), and strong adhesion to various substrates. It is designed for electronic applications requiring efficient heat dissipation. The adhesive is thixotropic, allowing it to flow under shear for easy dispensing and self-leveling.

2. Applications

  • Bonding organic and ceramic substrates to heat sinks in electronic control modules (e.g., automotive electronics).
  • Thermal management in PCB system assemblies and compact electronic designs.
  • Providing reliable heat dissipation to improve the performance and longevity of electronic components.

3. Typical Properties

Property Unit Result
Type One-part
Color Gray
Viscosity cP 83,300
Thixotropy 3.9
Specific Gravity (Cured) 2.61
Durometer Hardness Shore A 87
Tensile Strength psi (MPa) 545 (3.8)
Elongation % 15
Lap Shear Adhesion (Aluminum) psi (MPa) 518 (3.6)
Cure Time @100°C minutes 40
Cure Time @125°C minutes 10
Cure Time @150°C minutes 3
Thermal Conductivity W/mK 1.7
Dielectric Strength kV/mm 16
Dielectric Constant @ 100 Hz 5.64
Dielectric Constant @ 100 kHz 5.51
Volume Resistivity ohm·cm 7.1E+13
Dissipation Factor @ 100 Hz 0.007
Dissipation Factor @ 100 kHz < 0.0001
Arc Track Resistance seconds 352
Linear CTE (Coefficient of Thermal Expansion) ppm/°C 138
UL Flammability Classification UL 94 V-0

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