Brand: Bostik
Product Number: Thermelt 892 Black
Technology: Polyamide Hot Melt Resin
Color: Black
Cure Type: Low-Pressure Molding
Package Size: 20Kg bag (pellets)
Shelf Life: Contact us for details.
Bostik Thermelt 892 Black is a pure copolymer polyamide hot melt resin, designed for low-pressure molding applications. It is non-reactive, solvent-free, and formulated for molding electronic/electrical components, connectors, and cables. The adhesive provides high strength and hardness while maintaining flame retardancy (UL94 V-0, UL file E116659).
| Property | Value | Standard Test |
|---|---|---|
| Viscosity (200°C, SC4, 50 RPM) | 4.0–5.0 Pa.s | ASTM D3236 |
| Softening Point | 170–180°C | ASTM D3461 |
| Water Content | <0.2% | Bostik Internal Test |
| Commercial Shape | Pellets | — |
| Property | Value | Standard Test |
|---|---|---|
| Vicat Softening Temperature (A120) | 69°C | ISO 306 |
| Glass Transition Temperature | -35°C | Bostik Internal Test |
| Property | Value | Standard Test |
|---|---|---|
| Yield Strength (50 mm/min, 23°C) | 9.5 MPa | ISO 527 |
| Strength at Break (50 mm/min, 23°C) | 9.5 MPa | ISO 527 |
| Elongation at Break (50 mm/min, 23°C) | 530% | ISO 527 |
| Young’s Modulus (50 mm/min, 23°C) | 230 MPa | ISO 527 |
| Property | Value | Standard Test |
|---|---|---|
| Transversal Resistivity (500V) | 1.0 × 10¹² Ω·cm | IEC 60093 |
| Dielectric Rigidity (23°C) | 19 kV/mm | IEC 60243-1 |
| Relative Permittivity (50Hz, 23°C) | 4.0 F/m | IEC 60250 |
| Property | Value | Standard Test |
|---|---|---|
| Density | ~1 | Internal Test |
| Water Absorption (Immersed, 23°C) | — | ISO 62 |
| Hardness (Shore D, 23°C) | 53 | ISO 868 |
| Parameter | Value |
|---|---|
| Melt Temperature Range | 200–230°C |
| Mold Temperature Range | 20–60°C |
| Drying Time (Air Oven, Thin Layer) | 8 hours |
| Drying Temperature | 70°C |
| Processing Moisture Content | <0.2% |
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